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OMAPL138BZWTA3E

OMAPL138BZWTA3E

Manufacturer No:

OMAPL138BZWTA3E

Manufacturer:

Texas Instruments

Description:

IC MPU OMAP-L1X 375MHZ 361NFBGA

Datasheet:

Datasheet

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OMAPL138BZWTA3E Specifications

  • Type
    Parameter
  • Supplier Device Package
    361-NFBGA (16x16)
  • Package / Case
    361-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Boot Security, Cryptography
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • SATA
    SATA 3Gbps (1)
  • Ethernet
    10/100Mbps (1)
  • Display & Interface Controllers
    LCD
  • Graphics Acceleration
    No
  • RAM Controllers
    SDRAM
  • Co-Processors/DSP
    Signal Processing; C674x, System Control; CP15
  • Speed
    375MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM926EJ-S
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    OMAP-L1x
The TLV320AIC23IPW is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. High-Quality Audio: The TLV320AIC23IPW provides high-quality audio performance with a dynamic range of 100 dB and a total harmonic distortion of -85 dB. This makes it suitable for applications that require clear and accurate audio reproduction.2. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered devices such as portable audio players, smartphones, and tablets.3. Versatile Audio Interface: The TLV320AIC23IPW supports various audio interfaces, including I2S, left-justified, right-justified, and DSP formats. This versatility allows it to be used in a wide range of audio systems and devices.4. Integrated Audio Features: The chip includes several integrated audio features such as a stereo audio ADC (Analog-to-Digital Converter) and DAC (Digital-to-Analog Converter), programmable gain amplifiers, and a digital audio interface. These features simplify the design and reduce the component count in audio systems.5. Noise and Echo Cancellation: The TLV320AIC23IPW includes built-in noise and echo cancellation algorithms, making it suitable for applications that require clear audio communication, such as hands-free car kits, conference systems, and VoIP phones.6. Audio Processing Capabilities: The chip supports audio processing functions such as equalization, filtering, and mixing. This makes it suitable for applications that require audio signal processing, such as audio effects processors, audio mixers, and audio recording devices.7. Industrial and Automotive Applications: The TLV320AIC23IPW is designed to operate in harsh environments and is suitable for industrial and automotive applications. It can withstand high temperatures, voltage fluctuations, and electromagnetic interference.Overall, the TLV320AIC23IPW integrated circuit chip offers high-quality audio performance, low power consumption, versatile audio interfaces, integrated audio features, noise and echo cancellation, audio processing capabilities, and suitability for industrial and automotive applications.
OMAPL138BZWTA3E Relevant information