MPC8545EVTANGD

MPC8545EVTANGD

Manufacturer No:

MPC8545EVTANGD

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC85XX 800MHZ 783FCPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MPC8545EVTANGD Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Cryptography, Random Number Generator
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    -
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (4)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2, SDRAM
  • Co-Processors/DSP
    Signal Processing; SPE, Security; SEC
  • Speed
    800MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC85xx
The BCM53547A0IFSBG is a specific model of integrated circuit chip developed by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BCM53547A0IFSBG:Advantages: 1. High Performance: The BCM53547A0IFSBG chip is designed to deliver high-performance networking capabilities, making it suitable for demanding applications. 2. Integration: It integrates multiple functions and features into a single chip, reducing the need for additional components and simplifying the overall design. 3. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 4. Scalability: The chip offers scalability options, allowing it to be used in a wide range of applications, from small-scale deployments to large-scale networks. 5. Security Features: The BCM53547A0IFSBG chip includes built-in security features to help protect against various threats and vulnerabilities.Application Scenarios: 1. Enterprise Networking: The chip can be used in enterprise networking equipment such as routers, switches, and access points, providing high-speed connectivity and advanced networking features. 2. Home Networking: It can be used in home routers and gateways, enabling high-performance Wi-Fi connectivity, network management, and security features. 3. Internet of Things (IoT): The chip can be utilized in IoT devices and gateways, enabling connectivity, data processing, and secure communication between devices and the cloud. 4. Smart Cities: It can be used in networking infrastructure for smart city applications, such as intelligent transportation systems, smart lighting, and surveillance systems. 5. Industrial Automation: The chip can be employed in industrial networking equipment, enabling reliable and secure communication in industrial automation and control systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and capabilities of the BCM53547A0IFSBG chip, and it is always recommended to refer to the manufacturer's documentation and specifications for accurate information.