OMAP3503ECBCA
Manufacturer No:
OMAP3503ECBCA
Manufacturer:
Description:
IC MPU OMAP-35XX 600MHZ 515FCBGA
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OMAP3503ECBCA Specifications
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TypeParameter
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Supplier Device Package515-POP-FCBGA (14x14)
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Package / Case515-VFBGA, FCBGA
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Mounting TypeSurface Mount
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Security Features-
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Operating Temperature-40°C ~ 105°C (TJ)
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Voltage - I/O1.8V, 3.0V
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USBUSB 1.x (3), USB 2.0 (1)
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SATA-
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Ethernet-
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Display & Interface ControllersLCD
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Graphics AccelerationNo
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RAM ControllersLPDDR
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Co-Processors/DSPMultimedia; NEON™ SIMD
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Speed600MHz
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Number of Cores/Bus Width1 Core, 32-Bit
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Core ProcessorARM® Cortex®-A8
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PackagingTray
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Product StatusObsolete
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SeriesOMAP-35xx
The OMAP3503DCBBA integrated circuit (IC) chips, developed by Texas Instruments, have several advantages and application scenarios. Some of them include:1. High Performance: The OMAP3503DCBBA chips are designed to deliver high performance with a 600 MHz ARM Cortex-A8 processor. This makes them suitable for applications that require fast processing speeds.2. Low Power Consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices. They incorporate power management techniques to maximize battery life.3. Multimedia Capabilities: The OMAP3503DCBBA chips have integrated multimedia accelerators, including a 2D/3D graphics accelerator and a video accelerator. This enables them to handle multimedia-intensive applications such as gaming, video playback, and image processing.4. Connectivity Options: These chips support various connectivity options, including USB, Ethernet, and multiple serial interfaces. This makes them suitable for applications that require connectivity to external devices or networks.5. Application Scenarios: The OMAP3503DCBBA chips find applications in a wide range of devices, including smartphones, tablets, portable media players, digital cameras, and industrial control systems. They are particularly well-suited for devices that require a balance between performance and power efficiency.6. Customizability: Texas Instruments provides a software development kit (SDK) for the OMAP3503DCBBA chips, allowing developers to customize and optimize the software for their specific application requirements. This flexibility makes them suitable for a wide range of applications.Overall, the OMAP3503DCBBA chips offer a combination of high performance, low power consumption, multimedia capabilities, and connectivity options, making them suitable for various application scenarios in the consumer electronics and industrial sectors.