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MPC8309CVMAGDCA

MPC8309CVMAGDCA

Manufacturer No:

MPC8309CVMAGDCA

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC83XX 400MHZ 489BGA

Datasheet:

Datasheet

Delivery:

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MPC8309CVMAGDCA Specifications

  • Type
    Parameter
  • Supplier Device Package
    489-PBGA (19x19)
  • Package / Case
    489-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 2.0 (1)
  • SATA
    -
  • Ethernet
    10/100Mbps (3)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2
  • Co-Processors/DSP
    Communications; QUICC Engine
  • Speed
    400MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e300c3
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC83xx
The MPC755BRX300LE is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It is a member of the PowerPC family of microprocessors. While specific advantages and application scenarios may vary depending on the use case, here are some general advantages and potential application scenarios for the MPC755BRX300LE:Advantages: 1. High Performance: The MPC755BRX300LE is designed to deliver high-performance computing capabilities, making it suitable for demanding applications that require significant processing power. 2. Power Efficiency: It is designed to be power-efficient, which can be advantageous in applications where power consumption is a concern. 3. Scalability: The PowerPC architecture allows for scalability, enabling the chip to be used in a wide range of applications, from embedded systems to high-performance computing. 4. Reliability: NXP Semiconductors is known for producing reliable and robust chips, ensuring the MPC755BRX300LE can operate reliably in various environments.Application Scenarios: 1. Embedded Systems: The MPC755BRX300LE can be used in embedded systems that require high-performance processing, such as industrial automation, robotics, or automotive applications. 2. Networking and Telecommunications: The chip's power and performance capabilities make it suitable for networking and telecommunications equipment, including routers, switches, and base stations. 3. Aerospace and Defense: The MPC755BRX300LE can be utilized in aerospace and defense applications, such as avionics systems, radar systems, or military-grade computing. 4. High-Performance Computing: Due to its high-performance capabilities, the chip can be used in applications that require intensive computational tasks, such as scientific research, simulations, or data analysis.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the official documentation and datasheets provided by NXP Semiconductors for detailed information on the MPC755BRX300LE chip.
MPC8309CVMAGDCA Relevant information