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MPC8306CVMAFDCA

MPC8306CVMAFDCA

Manufacturer No:

MPC8306CVMAFDCA

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC83XX 333MHZ 369BGA

Datasheet:

Datasheet

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MPC8306CVMAFDCA Specifications

  • Type
    Parameter
  • Supplier Device Package
    369-PBGA (19x19)
  • Package / Case
    369-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 2.0 (1)
  • SATA
    -
  • Ethernet
    10/100Mbps (3)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2
  • Co-Processors/DSP
    Communications; QUICC Engine
  • Speed
    333MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e300c3
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    MPC83xx
The R8A774C0HA01BG#U0 is an integrated circuit chip developed by Renesas Electronics Corporation. It is a system-on-chip (SoC) designed for automotive applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The R8A774C0HA01BG#U0 chip is built on a powerful ARM Cortex-A53 quad-core processor, providing high processing capabilities for demanding automotive applications. 2. Graphics and Multimedia Support: It features a PowerVR Series6XT GX6250 GPU, enabling advanced graphics rendering and multimedia processing. 3. Automotive-Grade Reliability: This chip is designed to meet the stringent requirements of the automotive industry, including high-temperature operation, long-term reliability, and robustness against environmental factors. 4. Comprehensive Connectivity: It offers various connectivity options such as Ethernet, CAN, USB, and HDMI, allowing seamless integration with other automotive systems and external devices. 5. Safety and Security Features: The R8A774C0HA01BG#U0 chip incorporates safety and security mechanisms, including hardware-based encryption, secure boot, and memory protection, ensuring the integrity and confidentiality of automotive systems.Application Scenarios: 1. Infotainment Systems: The chip's high-performance processor and graphics capabilities make it suitable for automotive infotainment systems, enabling advanced multimedia playback, navigation, and connectivity features. 2. Advanced Driver Assistance Systems (ADAS): The R8A774C0HA01BG#U0 chip can be used in ADAS applications, providing the processing power required for real-time image recognition, object detection, and sensor fusion. 3. Instrument Clusters: It can be utilized in automotive instrument clusters, delivering high-quality graphics and rendering capabilities for displaying critical vehicle information to the driver. 4. Telematics: The chip's connectivity options make it suitable for telematics applications, enabling vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, remote diagnostics, and over-the-air updates. 5. Gateway Modules: The R8A774C0HA01BG#U0 chip can be employed in automotive gateway modules, acting as a central hub for data communication between various in-vehicle networks, such as CAN, Ethernet, and LIN.Overall, the R8A774C0HA01BG#U0 integrated circuit chip offers high performance, reliability, and connectivity, making it well-suited for a range of automotive applications.
MPC8306CVMAFDCA Relevant information