MPC8272VRPIEA557

MPC8272VRPIEA557

Manufacturer No:

MPC8272VRPIEA557

Manufacturer:

Freescale Semiconductor

Description:

IC MPU MPC82XX 300MHZ PBGA516

Datasheet:

Datasheet

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Payment:

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MPC8272VRPIEA557 Specifications

  • Type
    Parameter
  • Supplier Device Package
    516-PBGA (27x27)
  • Package / Case
    516-BBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Cryptography, Random Number Generator
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    3.3V
  • USB
    USB 2.0 (1)
  • SATA
    -
  • Ethernet
    10/100Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM, SDRAM
  • Co-Processors/DSP
    Communications; RISC CPM, Security; SEC
  • Speed
    300MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC G2_LE
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    MPC82xx
The MPC8272VRPIEA557 is a specific model of the PowerQUICC II Pro integrated circuit chip developed by NXP Semiconductors. This chip is designed for networking and communication applications and offers several advantages and application scenarios:1. High Performance: The MPC8272VRPIEA557 chip is built on a Power Architecture core, providing high processing power and performance. It has a dual-core design with a core frequency of up to 400 MHz, enabling it to handle complex networking tasks efficiently.2. Networking Capabilities: This chip is specifically designed for networking applications and offers various networking features. It includes integrated Ethernet controllers, supporting multiple Ethernet interfaces, such as 10/100/1000 Mbps Ethernet ports. It also supports various networking protocols, including TCP/IP, UDP, IPv4, and IPv6.3. Security Features: The MPC8272VRPIEA557 chip incorporates security features to ensure data integrity and confidentiality. It includes hardware acceleration for encryption algorithms like DES, 3DES, AES, and SHA-1, providing secure communication channels for sensitive data.4. Flexible Connectivity: The chip offers multiple connectivity options, including PCI, USB, UART, I2C, and SPI interfaces. This allows for easy integration with various peripherals and external devices, enhancing its versatility in different application scenarios.5. Industrial Applications: The MPC8272VRPIEA557 chip is commonly used in industrial applications that require reliable and high-performance networking capabilities. It can be utilized in industrial automation, smart grid systems, network switches, routers, and other communication infrastructure.6. Embedded Systems: Due to its powerful processing capabilities and networking features, the chip is suitable for embedded systems that require networking functionality. It can be used in embedded devices like network appliances, gateways, and IoT (Internet of Things) devices.7. Telecommunications: The chip's networking capabilities make it suitable for telecommunications applications. It can be used in devices like IP phones, VoIP gateways, and network switches in telecommunications infrastructure.Overall, the MPC8272VRPIEA557 integrated circuit chip offers high performance, networking capabilities, security features, and flexible connectivity options, making it suitable for a wide range of networking and communication applications in industrial, embedded, and telecommunications sectors.