MPC8313EZQAFFB

MPC8313EZQAFFB

Manufacturer No:

MPC8313EZQAFFB

Manufacturer:

Freescale Semiconductor

Description:

IC MPU MPC83XX 333MHZ 516TEPBGA

Datasheet:

Datasheet

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Payment:

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MPC8313EZQAFFB Specifications

  • Type
    Parameter
  • Supplier Device Package
    516-TEPBGA (27x27)
  • Package / Case
    516-BBGA Exposed Pad
  • Mounting Type
    Surface Mount
  • Security Features
    Cryptography
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    USB 2.0 + PHY (1)
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2
  • Co-Processors/DSP
    Security; SEC 2.2
  • Speed
    333MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e300c3
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC83xx
The OMAP3503DCUS72 is an integrated circuit chip developed by Texas Instruments. It belongs to the OMAP (Open Multimedia Applications Platform) family of processors and is specifically designed for embedded systems and mobile devices. Here are some advantages and application scenarios of the OMAP3503DCUS72:Advantages: 1. High Performance: The OMAP3503DCUS72 chip offers a high-performance ARM Cortex-A8 processor running at up to 600 MHz. This allows for efficient multitasking and execution of complex applications. 2. Low Power Consumption: The chip incorporates power-saving features, enabling longer battery life for mobile devices. 3. Multimedia Capabilities: OMAP3503DCUS72 supports various multimedia codecs, including video and audio, making it suitable for applications requiring multimedia processing. 4. Connectivity: It provides multiple connectivity options such as USB, Ethernet, and various serial interfaces, enabling seamless integration with other devices. 5. Graphics Processing: The chip includes a PowerVR SGX graphics accelerator, delivering enhanced graphics performance for applications like gaming and user interfaces.Application Scenarios: 1. Mobile Devices: OMAP3503DCUS72 is commonly used in smartphones, tablets, and portable media players due to its multimedia capabilities, power efficiency, and connectivity options. 2. Industrial Automation: The chip's high performance and connectivity features make it suitable for industrial automation applications, such as control systems and human-machine interfaces. 3. Automotive Infotainment: OMAP3503DCUS72 can be utilized in automotive infotainment systems, providing multimedia processing, connectivity, and graphics capabilities for in-car entertainment and navigation. 4. Medical Devices: The chip's low power consumption and multimedia capabilities make it suitable for medical devices like portable ultrasound machines or patient monitoring systems. 5. Internet of Things (IoT): OMAP3503DCUS72 can be used in IoT devices that require multimedia processing, connectivity, and low power consumption, such as smart home automation systems or wearable devices.Overall, OMAP3503DCUS72 offers a balance between performance, power efficiency, and multimedia capabilities, making it suitable for a wide range of embedded system applications.