TG80960JS33

TG80960JS33

Manufacturer No:

TG80960JS33

Manufacturer:

Intel

Description:

IC MPU I960 33MHZ 132QFP

Datasheet:

Datasheet

Delivery:

Payment:

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TG80960JS33 Specifications

  • Type
    Parameter
  • Supplier Device Package
    132-QFP
  • Package / Case
    132-QFP
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 100°C (TC)
  • Voltage - I/O
    3.3V
  • USB
    -
  • SATA
    -
  • Ethernet
    -
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    -
  • Co-Processors/DSP
    -
  • Speed
    33MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    i960
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    i960
The XPC850DEZT50BUR2 is a specific model of integrated circuit chip from the XPC850 family, manufactured by NXP Semiconductors. This chip is a highly integrated microprocessor designed for embedded systems and offers several advantages and application scenarios:1. High Performance: The XPC850DEZT50BUR2 chip is based on the PowerPC architecture and offers a clock speed of 50 MHz. It provides high processing power, making it suitable for applications that require fast and efficient data processing.2. Integrated Peripherals: This chip integrates various peripherals such as UARTs, timers, interrupt controllers, and general-purpose I/O ports. These integrated peripherals reduce the need for additional external components, making it cost-effective and space-efficient for embedded system designs.3. Real-Time Applications: The XPC850DEZT50BUR2 chip is well-suited for real-time applications that require precise timing and responsiveness. Its integrated timers and interrupt controllers enable accurate timing and event-driven processing, making it suitable for applications like industrial automation, robotics, and control systems.4. Communication Interfaces: This chip supports various communication interfaces like Ethernet, serial ports, and parallel ports. It enables seamless connectivity with other devices and networks, making it suitable for applications such as network routers, switches, and communication gateways.5. Embedded Systems: The XPC850DEZT50BUR2 chip is specifically designed for embedded systems, which are computer systems integrated into other devices or machinery. It is commonly used in applications like automotive electronics, industrial control systems, medical devices, and consumer electronics.6. Low Power Consumption: The XPC850DEZT50BUR2 chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient devices. It helps in extending the battery life and reducing overall power consumption in portable devices and IoT applications.Overall, the XPC850DEZT50BUR2 integrated circuit chip offers high performance, integrated peripherals, real-time capabilities, communication interfaces, and low power consumption. These features make it suitable for a wide range of embedded system applications that require reliable and efficient processing.