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MPC8309VMAHFCA

MPC8309VMAHFCA

Manufacturer No:

MPC8309VMAHFCA

Manufacturer:

Freescale Semiconductor

Description:

IC MPU MPC83XX 417MHZ 489FBGA

Datasheet:

Datasheet

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Payment:

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MPC8309VMAHFCA Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    489-FBGA (19x19)
  • Package / Case
    489-LFBGA
  • Security Features
    -
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 2.0 (1)
  • SATA
    -
  • Ethernet
    10/100Mbps (3)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2
  • Co-Processors/DSP
    Communications; QUICC Engine
  • Speed
    417MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e300c3
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    MPC83xx
The BCM58625BB1IF10G integrated circuit chips, also known as the Broadcom StrataDNX Qumran-AX, offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The BCM58625BB1IF10G chips are designed to deliver high-performance networking capabilities, making them suitable for demanding applications. 2. Scalability: These chips offer scalability options, allowing for flexible deployment in various network environments. 3. Power Efficiency: The chips are designed to be power-efficient, reducing energy consumption and operating costs. 4. Integrated Features: The BCM58625BB1IF10G chips integrate multiple features such as packet processing, traffic management, and security, reducing the need for additional components. 5. Advanced Security: These chips provide advanced security features, including hardware-based encryption and authentication, ensuring data integrity and confidentiality.Application Scenarios: 1. Data Centers: The BCM58625BB1IF10G chips are suitable for data center applications, where high-performance networking and scalability are crucial for handling large volumes of data. 2. Service Provider Networks: These chips can be used in service provider networks to deliver high-speed and reliable connectivity for various services, such as internet access, voice, and video. 3. Enterprise Networks: The chips can be deployed in enterprise networks to provide high-performance and secure connectivity for multiple users and devices. 4. Telecommunication Infrastructure: The BCM58625BB1IF10G chips can be used in telecommunication infrastructure, such as routers and switches, to enable high-speed and reliable communication between different network nodes. 5. Edge Computing: These chips can be applied in edge computing scenarios, where low-latency and high-performance networking is required for processing data closer to the source.Overall, the BCM58625BB1IF10G integrated circuit chips offer high-performance networking capabilities, scalability, power efficiency, and advanced security features, making them suitable for various applications in data centers, service provider networks, enterprise networks, telecommunication infrastructure, and edge computing.
MPC8309VMAHFCA Relevant information