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MPC8378ECVRANGA

MPC8378ECVRANGA

Manufacturer No:

MPC8378ECVRANGA

Manufacturer:

Freescale Semiconductor

Description:

IC MPU MPC83XX 800MHZ PBGA689

Datasheet:

Datasheet

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MPC8378ECVRANGA Specifications

  • Type
    Parameter
  • Mounting Type
    Surface Mount
  • Supplier Device Package
    689-TEPBGA II (31x31)
  • Package / Case
    689-BBGA Exposed Pad
  • Security Features
    Cryptography, Random Number Generator
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    USB 2.0 + PHY (1)
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2
  • Co-Processors/DSP
    Security; SEC 3.0
  • Speed
    800MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e300c4s
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    MPC83xx
The BCM58625BB1KF14G is a specific model of integrated circuit (IC) chip developed by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BCM58625BB1KF14G:Advantages: 1. High Performance: The BCM58625BB1KF14G is designed to deliver high-performance processing capabilities, making it suitable for demanding applications. 2. Power Efficiency: Broadcom's IC chips are known for their power-efficient designs, helping to reduce energy consumption and extend battery life in portable devices. 3. Integration: The BCM58625BB1KF14G integrates multiple functions and features into a single chip, reducing the need for additional components and simplifying system design. 4. Scalability: The chip's architecture allows for scalability, enabling it to be used in a wide range of applications with varying performance requirements. 5. Connectivity: Broadcom's IC chips often include various connectivity options, such as Ethernet, USB, PCIe, and wireless interfaces, providing flexibility for different connectivity needs.Application Scenarios: 1. Networking Equipment: The BCM58625BB1KF14G can be used in networking equipment such as routers, switches, and access points, providing high-performance processing and connectivity capabilities. 2. Data Centers: With its high-performance processing and integration features, the chip can be utilized in data center infrastructure, including servers, storage systems, and network appliances. 3. Telecommunications: The chip's scalability and connectivity options make it suitable for telecommunications equipment, including base stations, gateways, and network switches. 4. Industrial Automation: The BCM58625BB1KF14G can be employed in industrial automation systems, enabling high-speed processing and connectivity for control and monitoring applications. 5. Internet of Things (IoT): With its power efficiency and integration capabilities, the chip can be utilized in IoT devices, such as smart home devices, wearables, and industrial IoT sensors.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the BCM58625BB1KF14G chip, and it is always recommended to refer to the manufacturer's documentation and guidelines for accurate information.
MPC8378ECVRANGA Relevant information