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MCIMX6Q5EYM12CE

MCIMX6Q5EYM12CE

Manufacturer No:

MCIMX6Q5EYM12CE

Manufacturer:

NXP USA Inc.

Description:

IC MPU I.MX6Q 1.2GHZ 624FCPBGA

Datasheet:

Datasheet

Delivery:

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MCIMX6Q5EYM12CE Specifications

  • Type
    Parameter
  • Supplier Device Package
    624-FCPBGA (21x21)
  • Package / Case
    624-LFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Operating Temperature
    -20°C ~ 105°C (TJ)
  • Voltage - I/O
    1.8V, 2.5V, 2.8V, 3.3V
  • USB
    USB 2.0 + PHY (4)
  • SATA
    SATA 3Gbps (1)
  • Ethernet
    10/100/1000Mbps (1)
  • Display & Interface Controllers
    Keypad, LCD
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR2, LVDDR3, DDR3
  • Co-Processors/DSP
    Multimedia; NEON™ SIMD
  • Speed
    1.2GHz
  • Number of Cores/Bus Width
    4 Core, 32-Bit
  • Core Processor
    ARM® Cortex®-A9
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    i.MX6Q
The MC850DECZQ50BUR2 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The MC850DECZQ50BUR2 chips are designed to deliver high performance with a clock frequency of 50 MHz, making them suitable for demanding applications. 2. Low Power Consumption: These chips are optimized for low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small Form Factor: The MC850DECZQ50BUR2 chips are available in a compact form factor, allowing for easy integration into various electronic devices and systems. 4. Robust Design: These chips are designed to withstand harsh environmental conditions, ensuring reliable operation in challenging applications. 5. Enhanced Security: The MC850DECZQ50BUR2 chips offer advanced security features, such as encryption and authentication, making them suitable for secure communication and data storage applications.Application Scenarios: 1. Internet of Things (IoT): The MC850DECZQ50BUR2 chips can be used in IoT devices, such as smart home systems, wearable devices, and industrial sensors, where low power consumption and high performance are essential. 2. Embedded Systems: These chips are suitable for embedded systems, including automotive electronics, medical devices, and industrial control systems, where compact size, reliability, and security are crucial. 3. Communication Systems: The MC850DECZQ50BUR2 chips can be used in communication systems, such as routers, switches, and network equipment, to provide high-speed data processing and secure communication. 4. Consumer Electronics: These chips can be utilized in various consumer electronics, such as smartphones, tablets, and gaming consoles, to enable efficient processing, extended battery life, and enhanced security features. 5. Aerospace and Defense: The MC850DECZQ50BUR2 chips can be employed in aerospace and defense applications, including avionics systems, military communication devices, and satellite systems, where high performance, reliability, and security are critical.Overall, the MC850DECZQ50BUR2 integrated circuit chips offer high performance, low power consumption, small form factor, robust design, and enhanced security, making them suitable for a wide range of applications in different industries.
MCIMX6Q5EYM12CE Relevant information