MCIMX536AVV8C2R2

MCIMX536AVV8C2R2

Manufacturer No:

MCIMX536AVV8C2R2

Manufacturer:

NXP USA Inc.

Description:

IC MPU I.MX53 800MHZ 529FBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MCIMX536AVV8C2R2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    529-FBGA (19x19)
  • Package / Case
    529-FBGA
  • Mounting Type
    Surface Mount
  • Security Features
    ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Operating Temperature
    -40°C ~ 125°C (TJ)
  • Voltage - I/O
    1.3V, 1.8V, 2.775V, 3.3V
  • USB
    USB 2.0 (2), USB 2.0 + PHY (2)
  • SATA
    SATA 1.5Gbps (1)
  • Ethernet
    10/100Mbps (1)
  • Display & Interface Controllers
    Keypad, LCD
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR2, DDR2, DDR3
  • Co-Processors/DSP
    Multimedia; NEON™ SIMD
  • Speed
    800MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM® Cortex®-A8
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    i.MX53
The M2S010S-1TQG144 integrated circuit chip, also known as the SmartFusion2 SoC FPGA, offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. Integration: The chip combines the capabilities of a microcontroller and a field-programmable gate array (FPGA) into a single device, providing the benefits of both technologies in one chip. 2. Flexibility: The FPGA fabric allows for reprogramming and customization of hardware functionality, enabling the chip to adapt to different application requirements. 3. Security: The chip includes security features such as secure boot, tamper detection, and secure key storage, making it suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered or energy-efficient devices. 5. High performance: The chip offers high-performance processing capabilities, enabling it to handle complex tasks and applications.Application Scenarios: 1. Industrial Automation: The chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. Its flexibility allows for customization to meet specific industrial requirements. 2. Internet of Things (IoT): The chip can be utilized in IoT devices for edge computing, data processing, and connectivity. Its low power consumption and security features make it suitable for IoT applications. 3. Automotive: The chip can be applied in automotive systems for functions like advanced driver assistance systems (ADAS), infotainment systems, and vehicle networking. Its high performance and security features are beneficial in automotive applications. 4. Aerospace and Defense: The chip can be used in aerospace and defense applications for tasks such as avionics, communication systems, and secure data processing. Its integration of microcontroller and FPGA capabilities allows for versatile and adaptable solutions. 5. Medical Devices: The chip can be employed in medical devices for tasks like signal processing, data acquisition, and control systems. Its security features and flexibility make it suitable for medical applications that require reliability and customization.These are just a few examples of the advantages and application scenarios of the M2S010S-1TQG144 integrated circuit chip. The chip's versatility and capabilities make it suitable for a wide range of industries and applications.