OMAP3530EZCBB

OMAP3530EZCBB

Manufacturer No:

OMAP3530EZCBB

Manufacturer:

Texas Instruments

Description:

IC MPU OMAP-35XX 600MHZ 515FCBGA

Datasheet:

Datasheet

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OMAP3530EZCBB Specifications

  • Type
    Parameter
  • Supplier Device Package
    515-POP-FCBGA (12x12)
  • Package / Case
    515-VFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 90°C (TJ)
  • Voltage - I/O
    1.8V, 3.0V
  • USB
    USB 1.x (3), USB 2.0 (1)
  • SATA
    -
  • Ethernet
    -
  • Display & Interface Controllers
    LCD
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR
  • Co-Processors/DSP
    Signal Processing; C64x+, Multimedia; NEON™ SIMD
  • Speed
    600MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM® Cortex®-A8
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    OMAP-35xx
The ADSST73311ARS-REEL integrated circuit chips have several advantages and are suitable for various application scenarios:1. High-Speed Data Conversion: These chips offer high-speed analog-to-digital conversion, typically up to 65 MSPS (Mega Samples Per Second). This makes them suitable for applications that require fast and accurate digitization of analog signals.2. Wide Input Bandwidth: The chips have a wide input bandwidth, typically up to 150 MHz. This allows them to handle a wide range of input signals without significant distortion, making them ideal for applications such as wideband communication systems, radar systems, and waveform digitizers.3. Excellent Dynamic Range: The ADSST73311ARS-REEL chips provide a high dynamic range, typically up to 81 dB. This means they can capture both low-amplitude signals and high-amplitude signals accurately, making them suitable for applications that require precise measurements across a wide range of signal amplitudes.4. Low Power Consumption: These chips are designed to operate at low power levels, making them suitable for portable and power-constrained applications. They offer a power-down mode option that further reduces power consumption when not actively converting analog signals.5. Flexible Digital Interface: The chips support various standard digital interfaces such as parallel CMOS and LVDS (Low Voltage Differential Signaling). This allows easy integration with different microcontrollers, FPGAs (Field-Programmable Gate Arrays), or digital signal processors.Application scenarios for ADSST73311ARS-REEL integrated circuit chips include:1. Communication Systems: These chips can be used in high-speed data communication systems, such as optical communication receivers, where accurate and fast analog-to-digital conversion is required.2. Instrumentation and Test Equipment: The high-speed and high-precision capabilities of these chips make them suitable for use in spectrum analyzers, oscilloscopes, and other test and measurement devices.3. Medical Imaging: The chips can be used in medical imaging systems, such as ultrasound machines or MRI (Magnetic Resonance Imaging) systems, to convert analog signals from sensors into digital format for processing and analysis.4. Radar Systems: The wide input bandwidth and high dynamic range of these chips make them suitable for radar systems that require precise sensing and measurement of weak signals over a wide range of frequencies.5. Industrial Applications: The chips can be used in industrial monitoring and control systems, such as vibration analysis systems or process control systems, where accurate analog-to-digital conversion is necessary for data analysis and decision making.Overall, the ADSST73311ARS-REEL integrated circuit chips offer high-performance data conversion capabilities, making them suitable for a wide range of applications that require fast, accurate, and low-power analog-to-digital conversion.