MPC8536AVJAVLA

MPC8536AVJAVLA

Manufacturer No:

MPC8536AVJAVLA

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC85XX 1.5GHZ 783FCPBGA

Datasheet:

Datasheet

Delivery:

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MPC8536AVJAVLA Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 90°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    USB 2.0 (3)
  • SATA
    SATA 3Gbps (2)
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2, DDR3
  • Co-Processors/DSP
    -
  • Speed
    1.5GHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC85xx
The XCZU17EG-3FFVC1760E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios:Advantages: 1. High Performance: The XCZU17EG-3FFVC1760E chip provides high-performance processing capabilities with a combination of programmable logic and processing system. 2. Versatility: It integrates both a processing system (Quad-core ARM Cortex-A53) and programmable logic (Field-Programmable Gate Array - FPGA), allowing for a wide range of applications. 3. Programmability: The FPGA fabric in the chip allows for customization and reconfiguration of hardware, enabling flexibility and adaptability in various applications. 4. Power Efficiency: The chip is designed to optimize power consumption, making it suitable for applications with power constraints. 5. High-Speed Interfaces: It supports various high-speed interfaces like PCIe, Ethernet, USB, and DDR4, enabling connectivity with other devices and systems.Application Scenarios: 1. Embedded Systems: The XCZU17EG-3FFVC1760E chip is commonly used in embedded systems where a combination of processing power and programmable logic is required. It can be used in applications like industrial automation, robotics, and automotive systems. 2. High-Performance Computing: With its high-performance processing capabilities, the chip can be used in applications that require intensive computing tasks, such as data centers, scientific research, and machine learning. 3. Video and Image Processing: The FPGA fabric in the chip can be utilized for real-time video and image processing applications, including video surveillance, medical imaging, and computer vision. 4. Communication Systems: The chip's support for high-speed interfaces makes it suitable for communication systems, including wireless base stations, network switches, and routers. 5. Aerospace and Defense: The XCZU17EG-3FFVC1760E chip can be used in aerospace and defense applications, such as radar systems, avionics, and secure communication systems, where high performance, customization, and reliability are crucial.It's important to note that the specific application scenarios may vary depending on the requirements and design choices made by the system developers.