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MPC8536AVJAULA
Manufacturer No:
MPC8536AVJAULA
Manufacturer:
Description:
IC MPU MPC85XX 1.333GHZ 783BGA
Datasheet:
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MPC8536AVJAULA Specifications
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TypeParameter
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Supplier Device Package783-FCPBGA (29x29)
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Package / Case783-BBGA, FCBGA
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Mounting TypeSurface Mount
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Security Features-
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Operating Temperature0°C ~ 90°C (TA)
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Voltage - I/O1.8V, 2.5V, 3.3V
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USBUSB 2.0 (3)
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SATASATA 3Gbps (2)
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Ethernet10/100/1000Mbps (2)
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Display & Interface Controllers-
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Graphics AccelerationNo
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RAM ControllersDDR2, DDR3
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Co-Processors/DSP-
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Speed1.333GHz
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Number of Cores/Bus Width1 Core, 32-Bit
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Core ProcessorPowerPC e500
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PackagingTray
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PackagingBulk
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Product StatusObsolete
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SeriesMPC85xx
The BCM1125HB0K600G is a specific model of integrated circuit (IC) chip manufactured by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BCM1125HB0K600G:Advantages: 1. High Performance: The BCM1125HB0K600G is designed to deliver high-performance networking capabilities, making it suitable for demanding applications. 2. Integration: This IC chip integrates multiple functions and features into a single package, reducing the need for additional components and simplifying the overall design. 3. Power Efficiency: Broadcom's IC chips are known for their power-efficient designs, helping to reduce energy consumption and extend battery life in portable devices. 4. Scalability: The BCM1125HB0K600G is designed to be scalable, allowing for flexible deployment in various network environments. 5. Reliability: Broadcom is a reputable manufacturer known for producing reliable and high-quality IC chips, ensuring the longevity and stability of the product.Application Scenarios: 1. Networking Equipment: The BCM1125HB0K600G can be used in networking equipment such as routers, switches, and access points to provide high-speed data transfer, routing, and network management capabilities. 2. Data Centers: With its high-performance networking capabilities, the chip can be used in data centers to handle large volumes of data, facilitate efficient communication between servers, and support virtualization technologies. 3. Telecommunications: The chip can be utilized in telecommunications infrastructure, including base stations, to enable fast and reliable communication between network nodes and support various wireless protocols. 4. Industrial Automation: The BCM1125HB0K600G can be employed in industrial automation systems to enable real-time communication, data exchange, and control between different components and devices. 5. Internet of Things (IoT): With its power efficiency and integration capabilities, the chip can be used in IoT devices to enable connectivity, data processing, and communication with other devices or cloud services.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product in which the BCM1125HB0K600G is being used.