MPC8535AVJATHA

MPC8535AVJATHA

Manufacturer No:

MPC8535AVJATHA

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC85XX 1.25GHZ 783FCPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MPC8535AVJATHA Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 90°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    USB 2.0 (2)
  • SATA
    SATA 3Gbps (1)
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2, DDR3
  • Co-Processors/DSP
    -
  • Speed
    1.25GHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC85xx
The XCZU19EG-3FFVB1517E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU19EG-3FFVB1517E:Advantages: 1. High-performance processing: The XCZU19EG-3FFVB1517E chip features a quad-core ARM Cortex-A53 processor and a dual-core ARM Cortex-R5 real-time processor. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators or interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU19EG-3FFVB1517E chip includes a wide range of integrated peripherals, such as USB, Ethernet, PCIe, and DDR memory controllers. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications. It includes power management features that allow dynamic power scaling based on workload requirements.Application scenarios: 1. Embedded systems: The XCZU19EG-3FFVB1517E chip is commonly used in embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. High-performance computing: The chip's processing capabilities make it suitable for high-performance computing applications. It can be used in areas such as data centers, scientific research, and signal processing.3. Video and image processing: The XCZU19EG-3FFVB1517E chip's programmable logic resources can be utilized to implement custom video and image processing algorithms. This makes it suitable for applications such as video surveillance, medical imaging, and multimedia systems.4. Wireless communication: The chip's integrated peripherals, processing power, and programmable logic resources make it suitable for wireless communication applications. It can be used in areas such as 5G base stations, software-defined radios, and wireless network infrastructure.Overall, the XCZU19EG-3FFVB1517E chip offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it versatile for a wide range of applications.