Home / Microprocessors / MC8641DTVJ1333JE/
MC8641DTVJ1333JE

MC8641DTVJ1333JE

Manufacturer No:

MC8641DTVJ1333JE

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC86XX 1.333GHZ 1023BGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MC8641DTVJ1333JE Specifications

  • Type
    Parameter
  • Supplier Device Package
    1023-FCCBGA (33x33)
  • Package / Case
    1023-BCBGA, FCCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    -
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (4)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2
  • Co-Processors/DSP
    -
  • Speed
    1.333GHz
  • Number of Cores/Bus Width
    2 Core, 32-Bit
  • Core Processor
    PowerPC e600
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC86xx
The XCZU11EG-3FFVC1760E integrated circuit chips are based on the Xilinx Zynq Ultrascale+ architecture and offer several advantages and application scenarios:Advantages: 1. High-performance: The XCZU11EG-3FFVC1760E chips feature a quad-core Arm Cortex-A53 processor and a dual-core Arm Cortex-R5 real-time processor, providing high processing power for demanding applications. 2. FPGA integration: These chips combine the processing capabilities of an application processor with the flexibility and reconfigurability of an FPGA, enabling hardware acceleration and optimization of algorithms. 3. Low power consumption: The Ultrascale+ architecture is designed to optimize power efficiency, making it suitable for power-constrained applications. 4. Rich I/O capabilities: The chips offer a wide range of high-speed transceivers, GPIOs, and interfaces supporting protocols like PCIe, Ethernet, USB, and more, allowing for easy integration with various peripherals.Application Scenarios: 1. Data center acceleration: The XCZU11EG-3FFVC1760E chips can be used in data centers for accelerating compute-intensive workloads, such as machine learning, image and video processing, and big data analytics. 2. Automotive: These chips are suitable for automotive applications like advanced driver assistance systems (ADAS), digital cockpit displays, and infotainment systems, where real-time processing, parallel computing, and connectivity are critical. 3. Industrial automation: With their combination of processing power and FPGAs, these chips are ideal for industrial automation, enabling real-time control, advanced machine vision, robotics, and communication protocols used in factories and smart manufacturing. 4. Aerospace and defense: The XCZU11EG-3FFVC1760E chips can be utilized in aerospace and defense applications, including radar and sonar systems, secure communications, mission control systems, and avionics, where high-performance processing and reconfigurable logic are required. 5. Wireless communication: These chips can be used in wireless communication infrastructure, such as base stations and radio units, to handle signal processing tasks, adapt to changing protocols, and support high data rates.Overall, the XCZU11EG-3FFVC1760E integrated circuit chips offer a versatile solution for a wide range of applications requiring high-performance processing, flexibility, and hardware acceleration.
MC8641DTVJ1333JE Relevant information