MC8640DVJ1067NE

MC8640DVJ1067NE

Manufacturer No:

MC8640DVJ1067NE

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC86XX 1.067GHZ 1023BGA

Datasheet:

Datasheet

Delivery:

Payment:

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MC8640DVJ1067NE Specifications

  • Type
    Parameter
  • Supplier Device Package
    1023-FCCBGA (33x33)
  • Package / Case
    1023-BCBGA, FCCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    -
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (4)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2
  • Co-Processors/DSP
    -
  • Speed
    1.067GHz
  • Number of Cores/Bus Width
    2 Core, 32-Bit
  • Core Processor
    PowerPC e600
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC86xx
The M2S005-1TQG144I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for this IC chip:Advantages: 1. High Performance: The M2S005-1TQG144I chip offers high-performance capabilities, making it suitable for demanding applications that require fast processing speeds and efficient data handling. 2. Low Power Consumption: This IC chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Small Form Factor: The chip comes in a compact package, allowing for space-saving designs and integration into small devices or systems. 4. Programmable Logic: The M2S005-1TQG144I is a field-programmable gate array (FPGA) chip, which means it can be reprogrammed or reconfigured to perform different functions or tasks. This flexibility makes it suitable for a wide range of applications. 5. High Integration: The chip offers a high level of integration, incorporating various components and functionalities into a single device. This integration simplifies the design process and reduces the need for additional external components.Application Scenarios: 1. Embedded Systems: The M2S005-1TQG144I chip can be used in embedded systems, such as industrial automation, robotics, or IoT devices, where it can provide processing power, control logic, and connectivity features. 2. Communications: The chip can be utilized in communication systems, including network routers, switches, or wireless base stations, to handle data processing, protocol handling, and signal routing tasks. 3. Aerospace and Defense: The high-performance and low-power characteristics of the chip make it suitable for aerospace and defense applications, such as avionics systems, radar systems, or military communication equipment. 4. Medical Devices: The M2S005-1TQG144I chip can be employed in medical devices, such as imaging systems, patient monitoring devices, or diagnostic equipment, where it can handle data processing, control functions, or interface with other components. 5. Automotive: The chip can find applications in automotive systems, including advanced driver-assistance systems (ADAS), infotainment systems, or engine control units (ECUs), where it can provide processing power, sensor interfacing, or control logic.It's important to note that the specific advantages and application scenarios may vary depending on the requirements, and it is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information about the M2S005-1TQG144I chip.