Home / Microprocessors / OMAPL138BZWTA4/
OMAPL138BZWTA4

OMAPL138BZWTA4

Manufacturer No:

OMAPL138BZWTA4

Manufacturer:

Texas Instruments

Description:

IC MPU OMAP-L1X 456MHZ 361NFBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

OMAPL138BZWTA4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    361-NFBGA (16x16)
  • Package / Case
    361-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Boot Security, Cryptography
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • SATA
    SATA 3Gbps (1)
  • Ethernet
    10/100Mbps (1)
  • Display & Interface Controllers
    LCD
  • Graphics Acceleration
    No
  • RAM Controllers
    SDRAM
  • Co-Processors/DSP
    Signal Processing; C674x, System Control; CP15
  • Speed
    456MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM926EJ-S
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    OMAP-L1x
The TP3070V-G is an integrated circuit chip that is commonly used in wireless audio applications. Some of the advantages and application scenarios of this chip are:1. Low power consumption: The TP3070V-G chip is designed to operate on low power, making it suitable for battery-powered devices such as wireless headphones or portable speakers.2. Bluetooth connectivity: This chip supports Bluetooth technology, allowing seamless wireless connectivity with other Bluetooth-enabled devices such as smartphones, tablets, or laptops.3. High-quality audio: The TP3070V-G chip is capable of delivering high-quality audio output, ensuring a superior listening experience for users.4. Compact size: The chip is designed to be compact, making it suitable for integration into small-sized devices where space is limited.5. Easy integration: The TP3070V-G chip comes with a comprehensive software development kit (SDK) and reference designs, making it easier for manufacturers to integrate the chip into their products.6. Application scenarios: The TP3070V-G chip can be used in various wireless audio applications such as wireless headphones, wireless speakers, wireless earbuds, and other audio devices that require Bluetooth connectivity.Overall, the TP3070V-G chip offers low power consumption, Bluetooth connectivity, high-quality audio output, and easy integration, making it a suitable choice for manufacturers developing wireless audio devices.
OMAPL138BZWTA4 Relevant information