MPC8547ECVJAQGD

MPC8547ECVJAQGD

Manufacturer No:

MPC8547ECVJAQGD

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC85XX 1.0GHZ 783FCPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MPC8547ECVJAQGD Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Cryptography, Random Number Generator
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    -
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (4)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2, SDRAM
  • Co-Processors/DSP
    Signal Processing; SPE, Security; SEC
  • Speed
    1.0GHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC85xx
The 10AS027H2F35E2SG is an integrated circuit chip from Intel's Arria 10 series of field-programmable gate arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 10AS027H2F35E2SG chip offers high-performance capabilities with a maximum operating frequency of up to 1.5 GHz. It provides fast processing speeds for various applications. 2. Flexibility: Being an FPGA, it allows for reprogramming and customization of the chip's functionality even after deployment. This flexibility makes it suitable for a wide range of applications. 3. High Logic Density: The chip has a high logic density, which means it can accommodate a large number of logic elements, allowing for complex designs and implementations. 4. Low Power Consumption: The 10AS027H2F35E2SG chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Rich Feature Set: It offers a rich set of features, including high-speed transceivers, memory interfaces, digital signal processing (DSP) blocks, and more, enabling the implementation of diverse applications.Application Scenarios: 1. Communications: The high-performance and high-speed transceivers of the 10AS027H2F35E2SG chip make it suitable for applications in telecommunications, networking, and wireless communication systems. 2. Industrial Automation: The flexibility and high logic density of the chip make it ideal for implementing complex control systems, data acquisition, and processing in industrial automation applications. 3. Video and Image Processing: The chip's DSP blocks and high-performance capabilities make it suitable for video and image processing applications, such as video encoding/decoding, image recognition, and computer vision. 4. High-Performance Computing: The 10AS027H2F35E2SG chip can be used in high-performance computing applications, such as scientific simulations, data analytics, and machine learning, where fast processing speeds and parallel computing are required. 5. Aerospace and Defense: The chip's reliability, low power consumption, and high-performance features make it suitable for aerospace and defense applications, including radar systems, avionics, and secure communications.These are just a few examples of the advantages and application scenarios of the 10AS027H2F35E2SG integrated circuit chip. The versatility and capabilities of FPGAs allow them to be used in various industries and applications, depending on the specific requirements.