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MPC8536EBVJAKGA

MPC8536EBVJAKGA

Manufacturer No:

MPC8536EBVJAKGA

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC85XX 600MHZ 783FCPBGA

Datasheet:

Datasheet

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MPC8536EBVJAKGA Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Cryptography
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    1.8V, 2.5V, 3.3V
  • USB
    USB 2.0 (3)
  • SATA
    SATA 3Gbps (2)
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2, DDR3
  • Co-Processors/DSP
    Security; SEC
  • Speed
    600MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC85xx
The XPC850DEVR66BU is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It belongs to the PowerQUICC family of microprocessors and is designed for embedded systems and networking applications. Here are some advantages and application scenarios of the XPC850DEVR66BU:Advantages: 1. High Performance: The XPC850DEVR66BU chip offers a clock speed of 66 MHz, providing fast processing capabilities for embedded systems. 2. Integrated Features: It combines a PowerPC core, memory management unit, communication interfaces, and other peripherals on a single chip, reducing the need for additional components. 3. Low Power Consumption: The chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or applications with power constraints. 4. Networking Capabilities: The XPC850DEVR66BU chip includes various communication interfaces like Ethernet, UART, SPI, I2C, and CAN, enabling seamless integration into networking applications. 5. Scalability: It supports various memory options, including SRAM, Flash, and SDRAM, allowing flexibility in designing systems with different memory requirements.Application Scenarios: 1. Embedded Systems: The XPC850DEVR66BU chip is commonly used in embedded systems like industrial automation, robotics, and control systems, where high-performance processing and low power consumption are essential. 2. Networking Equipment: Due to its networking capabilities, the chip finds applications in networking equipment such as routers, switches, gateways, and network interface cards (NICs). 3. Communication Systems: It can be used in communication systems like modems, wireless access points, and telecommunication infrastructure equipment. 4. Automotive Electronics: The XPC850DEVR66BU chip is suitable for automotive applications, including engine control units (ECUs), infotainment systems, and advanced driver-assistance systems (ADAS). 5. Internet of Things (IoT): With its integrated features and low power consumption, the chip can be utilized in IoT devices, such as smart home automation, wearable devices, and sensor networks.It's important to note that the specific application scenarios may vary depending on the system requirements and the overall design considerations.
MPC8536EBVJAKGA Relevant information