Share
P1014NXN5DFB
Manufacturer No:
P1014NXN5DFB
Manufacturer:
Description:
IC MPU QORIQ P1 800MHZ 425TEPBGA
Datasheet:
Delivery:
Payment:
In Stock : 0
Please send RFQ , we will respond immediately.
P1014NXN5DFB Specifications
-
TypeParameter
-
Supplier Device Package425-TEPBGA I (19x19)
-
Package / Case425-FBGA
-
Mounting TypeSurface Mount
-
Security Features-
-
Operating Temperature-40°C ~ 105°C (TA)
-
Voltage - I/O-
-
USBUSB 2.0 + PHY (1)
-
SATASATA 3Gbps (2)
-
Ethernet10/100/1000Mbps (2)
-
Display & Interface Controllers-
-
Graphics AccelerationNo
-
RAM ControllersDDR3, DDR3L
-
Co-Processors/DSP-
-
Speed800MHz
-
Number of Cores/Bus Width1 Core, 32-Bit
-
Core ProcessorPowerPC e500v2
-
PackagingTray
-
Product StatusObsolete
-
SeriesQorIQ P1
The M2S060T-FGG676 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060T-FGG676 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. These features enhance the security of the system and protect against unauthorized access or tampering. 4. Low power consumption: The M2S060T-FGG676 chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S060T-FGG676 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of interfaces and protocols, while the microcontroller subsystem handles control and communication tasks. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip is well-suited for IoT applications. It can be used for sensor data acquisition, data processing, and communication with cloud services or other devices. 3. Aerospace and defense: The M2S060T-FGG676 chip's security features make it suitable for aerospace and defense applications. It can be used in secure communication systems, encryption/decryption modules, or secure data storage. 4. Medical devices: The chip's low power consumption and high performance make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, or implantable devices. 5. Communications: The M2S060T-FGG676 chip can be used in communication systems for tasks such as protocol conversion, signal processing, or network interface customization.These are just a few examples of the advantages and application scenarios of the M2S060T-FGG676 chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
