P1014NSE5DFB

P1014NSE5DFB

Manufacturer No:

P1014NSE5DFB

Manufacturer:

NXP USA Inc.

Description:

IC MPU QORIQ P1 800MHZ 425TEPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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P1014NSE5DFB Specifications

  • Type
    Parameter
  • Supplier Device Package
    425-TEPBGA I (19x19)
  • Package / Case
    425-FBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    -
  • USB
    USB 2.0 + PHY (1)
  • SATA
    SATA 3Gbps (2)
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR3, DDR3L
  • Co-Processors/DSP
    Security; SEC 4.4
  • Speed
    800MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500v2
  • Packaging
    Tray
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    QorIQ P1
The 10AS027H4F35E3LG integrated circuit (IC) chips are part of the Intel Arria 10 series of field-programmable gate arrays (FPGAs). These chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the 10AS027H4F35E3LG IC chips are:Advantages: 1. High Performance: The Arria 10 series FPGAs provide high-performance capabilities, making them suitable for demanding applications that require fast processing speeds. 2. Flexibility: FPGAs are programmable, allowing users to customize the chip's functionality according to their specific requirements. This flexibility makes them suitable for a wide range of applications. 3. Low Power Consumption: The 10AS027H4F35E3LG chips are designed to be power-efficient, making them suitable for applications where power consumption is a concern. 4. High Integration: These chips offer a high level of integration, allowing for the consolidation of multiple functions onto a single chip. This integration reduces the need for additional components and simplifies the overall system design.Application Scenarios: 1. Communications: The high-performance capabilities of the 10AS027H4F35E3LG chips make them suitable for applications in the communications industry. They can be used in networking equipment, wireless communication systems, and data centers to handle high-speed data processing and routing. 2. Industrial Automation: These chips can be applied in industrial automation systems, where they can be used for real-time control, data acquisition, and signal processing. Their flexibility allows for customization to meet the specific requirements of different automation applications. 3. Video and Image Processing: The high-performance and integration capabilities of the 10AS027H4F35E3LG chips make them suitable for video and image processing applications. They can be used in video surveillance systems, image recognition, and video encoding/decoding. 4. Aerospace and Defense: The 10AS027H4F35E3LG chips can be applied in aerospace and defense systems, where they can be used for radar signal processing, communication systems, and encryption/decryption tasks. Their high-performance and low power consumption make them suitable for these demanding applications.It's important to note that the specific application scenarios may vary depending on the requirements and design choices made by the user.