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MPC8569CVJAQLJB

MPC8569CVJAQLJB

Manufacturer No:

MPC8569CVJAQLJB

Manufacturer:

NXP USA Inc.

Description:

IC MPU MPC85XX 1.067GHZ 783BGA

Datasheet:

Datasheet

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MPC8569CVJAQLJB Specifications

  • Type
    Parameter
  • Supplier Device Package
    783-FCPBGA (29x29)
  • Package / Case
    783-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - I/O
    1.0V, 1.5V, 1.8V, 2.5V, 3.3V
  • USB
    USB 2.0 (1)
  • SATA
    -
  • Ethernet
    10/100Mbps (8), 1Gbps (4)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2, DDR3, SDRAM
  • Co-Processors/DSP
    Communications; QUICC Engine
  • Speed
    1.067GHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500v2
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    MPC85xx
The M2S010-1VF256I is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S010-1VF256I chip combines an FPGA fabric with a hard ARM Cortex-M3 microcontroller subsystem, providing the flexibility of programmable logic along with the processing power of a microcontroller. 2. Integration: It integrates various components like FPGA fabric, microcontroller subsystem, memory, and peripherals on a single chip, reducing the need for external components and simplifying the overall system design. 3. Security: SmartFusion2 devices offer built-in security features like secure boot, secure key storage, and tamper detection, making them suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High reliability: SmartFusion2 devices are known for their reliability and radiation tolerance, making them suitable for applications in harsh environments.Application scenarios: 1. Industrial automation: The M2S010-1VF256I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric can be programmed to handle specific industrial protocols, while the microcontroller subsystem can handle the overall system control. 2. Aerospace and defense: The chip's radiation tolerance and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, satellite communication, secure data processing, and more. 3. Internet of Things (IoT): The chip's low power consumption and integration capabilities make it suitable for IoT applications. It can be used in smart home devices, wearable technology, and other IoT edge devices. 4. Medical devices: The chip's reliability and security features make it suitable for medical devices that require high levels of safety and data protection. It can be used in devices like patient monitors, medical imaging systems, and portable medical devices. 5. Communications: The chip can be used in communication systems like routers, switches, and network appliances. The FPGA fabric can be programmed to handle specific communication protocols, while the microcontroller subsystem can handle the overall system control and management.These are just a few examples, and the M2S010-1VF256I chip can be applied in various other domains where the combination of programmable logic and microcontroller capabilities is beneficial.
MPC8569CVJAQLJB Relevant information