OMAPL132BZWTA2R

OMAPL132BZWTA2R

Manufacturer No:

OMAPL132BZWTA2R

Manufacturer:

Texas Instruments

Description:

IC MPU OMAP-L1X 200MHZ 361NFBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

OMAPL132BZWTA2R Specifications

  • Type
    Parameter
  • Supplier Device Package
    361-NFBGA (16x16)
  • Package / Case
    361-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 2.0 + PHY (1)
  • SATA
    -
  • Ethernet
    10/100Mbps (1)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    LPDDR, DDR2
  • Co-Processors/DSP
    Signal Processing; C674x, System Control; CP15
  • Speed
    200MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM926EJ-S
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    OMAP-L1x
The TLV320AIC25IPFB is an integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. High-Quality Audio: The TLV320AIC25IPFB provides high-quality audio performance with low distortion and noise. It supports various audio formats and sampling rates, making it suitable for applications that require accurate and clear audio reproduction.2. Low Power Consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices such as portable audio players, smartphones, and tablets.3. Integrated Features: The TLV320AIC25IPFB integrates various features such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), audio amplifiers, and programmable filters. This integration reduces the need for external components, simplifying the design and reducing the overall cost of the system.4. Flexible Configuration: The chip offers flexible configuration options through its programmable registers, allowing designers to customize the audio processing parameters according to their specific requirements.5. Communication Interfaces: The TLV320AIC25IPFB supports various communication interfaces such as I2C, SPI, and GPIO, enabling easy integration with microcontrollers or digital signal processors (DSPs). This makes it suitable for applications that require audio processing and control, such as audio mixers, audio effects processors, and audio codecs.6. Automotive Applications: The TLV320AIC25IPFB is designed to meet the stringent requirements of automotive applications. It offers features like automotive-grade temperature range, electromagnetic compatibility (EMC) compliance, and enhanced reliability, making it suitable for automotive infotainment systems, car audio systems, and hands-free communication systems.7. Industrial Applications: The chip's robustness and reliability make it suitable for industrial applications that require high-quality audio processing, such as public address systems, intercoms, and audio monitoring systems.Overall, the TLV320AIC25IPFB integrated circuit chip offers high-quality audio performance, low power consumption, flexible configuration options, and integration of various features, making it suitable for a wide range of audio applications in consumer electronics, automotive, and industrial sectors.