P5010NXN1VNB

P5010NXN1VNB

Manufacturer No:

P5010NXN1VNB

Manufacturer:

NXP USA Inc.

Description:

IC MPU QORIQ P5 2.0GHZ 1295BGA

Datasheet:

Datasheet

Delivery:

Payment:

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P5010NXN1VNB Specifications

  • Type
    Parameter
  • Supplier Device Package
    1295-FCPBGA (37.5x37.5)
  • Package / Case
    1295-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - I/O
    -
  • USB
    USB 2.0 + PHY (2)
  • SATA
    SATA 3Gbps (2)
  • Ethernet
    1Gbps (5), 10Gbps (1)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR3, DDR3L
  • Co-Processors/DSP
    -
  • Speed
    2.0GHz
  • Number of Cores/Bus Width
    1 Core, 64-Bit
  • Core Processor
    PowerPC e5500
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    QorIQ P5
The XCZU19EG-3FFVD1760E is a high-performance integrated circuit chip from Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios:Advantages: 1. High Performance: The XCZU19EG-3FFVD1760E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance computing and real-time processing capabilities.2. Programmable Logic: The chip includes programmable logic resources, which can be customized and reconfigured to implement various functions and algorithms. This flexibility makes it suitable for a wide range of applications.3. Heterogeneous Processing: The combination of ARM processors and programmable logic enables the chip to handle both general-purpose processing tasks and specialized acceleration functions. This heterogeneous processing capability is advantageous for applications that require a mix of processing requirements.4. High-Speed Interfaces: The XCZU19EG-3FFVD1760E chip supports various high-speed interfaces, including PCIe, Ethernet, USB, and DDR4 memory interfaces. These interfaces enable connectivity with external devices and high-speed data transfer.Application Scenarios: 1. Embedded Systems: The XCZU19EG-3FFVD1760E chip is suitable for embedded systems that require high-performance processing and real-time capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge Computing: With its heterogeneous processing capabilities, the chip is well-suited for edge computing applications. It can perform local data processing and analysis, reducing the need for data transmission to the cloud. This is beneficial for applications like edge AI, IoT gateways, and smart surveillance systems.3. High-Bandwidth Data Processing: The high-speed interfaces of the chip make it suitable for applications that require high-bandwidth data processing. This includes areas like high-performance computing, data centers, and network infrastructure.4. Software-Defined Systems: The programmable logic resources of the chip enable the implementation of software-defined systems. It can be used in applications like software-defined networking (SDN), software-defined radio (SDR), and software-defined storage (SDS).Overall, the XCZU19EG-3FFVD1760E chip offers high-performance processing, flexibility, and connectivity, making it suitable for a wide range of applications that require advanced processing capabilities.