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P1017NSN5BFB

P1017NSN5BFB

Manufacturer No:

P1017NSN5BFB

Manufacturer:

NXP USA Inc.

Description:

IC MPU QORIQ P1 400MHZ 457TEPBGA

Datasheet:

Datasheet

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P1017NSN5BFB Specifications

  • Type
    Parameter
  • Supplier Device Package
    457-TEPBGA-1 (19x19)
  • Package / Case
    457-FBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    -
  • USB
    USB 2.0 + PHY (1)
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR3, DDR3L
  • Co-Processors/DSP
    -
  • Speed
    400MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC e500v2
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    QorIQ P1
The BCM85622IFSBG is a specific integrated circuit chip manufactured by Broadcom Limited. It is a dual NPN/PNP general-purpose transistor array. Here are some advantages and application scenarios of this chip:Advantages: 1. Dual NPN/PNP Transistors: The chip contains two NPN and two PNP transistors, which provide flexibility in various circuit designs. 2. High Current Gain: The transistors in this chip have high current gain, making them suitable for amplification and switching applications. 3. Small Package: The chip is available in a small SOT-363 package, which saves board space and allows for compact designs. 4. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered devices.Application Scenarios: 1. Amplification: The high current gain of the transistors makes this chip suitable for audio amplification circuits, sensor interfaces, and other applications where signal amplification is required. 2. Switching: The NPN and PNP transistors can be used as switches in digital circuits, such as logic gates, level shifters, and motor control circuits. 3. Signal Conditioning: The chip can be used for signal conditioning tasks, such as impedance matching, level shifting, and signal inversion. 4. Sensor Interfaces: The chip can be used in sensor interface circuits for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, and light sensors.It is important to note that the specific advantages and application scenarios may vary depending on the requirements of the circuit and the overall system design.
P1017NSN5BFB Relevant information