P3041NXE1PNB
Manufacturer No:
P3041NXE1PNB
Manufacturer:
Description:
IC MPU QORIQ P3 1.5GHZ 1295BGA
Datasheet:
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In Stock : 0
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P3041NXE1PNB Specifications
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TypeParameter
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Supplier Device Package1295-FCPBGA (37.5x37.5)
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Package / Case1295-BBGA, FCBGA
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Mounting TypeSurface Mount
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Security FeaturesBoot Security, Cryptography, Random Number Generator, Secure Fusebox
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Operating Temperature-40°C ~ 105°C (TA)
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Voltage - I/O1.5V, 1.8V, 2.5V, 3.3V
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USBUSB 2.0 + PHY (2)
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SATASATA 3Gbps (2)
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Ethernet10/100/1000Mbps (5), 10Gbps (1)
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Display & Interface Controllers-
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Graphics AccelerationNo
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RAM ControllersDDR3, DDR3L
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Co-Processors/DSPSecurity; SEC 4.2
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Speed1.5GHz
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Number of Cores/Bus Width4 Core, 32-Bit
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Core ProcessorPowerPC e500mc
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PackagingTray
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Product StatusObsolete
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SeriesQorIQ P3
The M2S050T-1FCS325I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050T-1FCS325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S050T-1FCS325I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S050T-1FCS325I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the microcontroller subsystem handles higher-level control and communication tasks. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip can be used in IoT devices that require both hardware flexibility and software programmability. It can be used for edge computing, data processing, and connectivity in IoT applications. 3. Aerospace and defense: The security features of the SmartFusion2 family make the M2S050T-1FCS325I chip suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's low power consumption and integration make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, and implantable devices. The FPGA fabric can be used for signal processing and customization, while the microcontroller subsystem handles data management and communication.These are just a few examples of the advantages and application scenarios of the M2S050T-1FCS325I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.