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MCIMX6X4AVM08AB

MCIMX6X4AVM08AB

Manufacturer No:

MCIMX6X4AVM08AB

Manufacturer:

NXP USA Inc.

Description:

IC MPU I.MX6SX 800MHZ 529MAPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MCIMX6X4AVM08AB Specifications

  • Type
    Parameter
  • Supplier Device Package
    529-MAPBGA (19x19)
  • Package / Case
    529-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
  • Operating Temperature
    -40°C ~ 125°C (TJ)
  • Voltage - I/O
    1.8V, 2.5V, 2.8V, 3.15V
  • USB
    USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • SATA
    -
  • Ethernet
    10/100/1000Mbps (2)
  • Display & Interface Controllers
    Keypad, LCD, LVDS
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR2, LVDDR3, DDR3
  • Co-Processors/DSP
    Multimedia; NEON™ MPE
  • Speed
    200MHz, 800MHz
  • Number of Cores/Bus Width
    2 Core, 32-Bit
  • Core Processor
    ARM® Cortex®-A9, ARM® Cortex®-M4
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    i.MX6SX
The BCM58622BB1KF10G is a specific model of integrated circuit chip developed by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The BCM58622BB1KF10G chip is designed to deliver high-performance networking capabilities, making it suitable for demanding applications. 2. Power Efficiency: Broadcom chips are known for their power-efficient designs, helping to reduce energy consumption and heat generation. 3. Integration: This chip integrates multiple functions and features into a single package, reducing the need for additional components and simplifying system design. 4. Scalability: The chip's architecture allows for scalability, enabling it to be used in various network infrastructure applications.Application Scenarios: 1. Data Centers: The BCM58622BB1KF10G chip can be used in data center switches and routers, providing high-speed connectivity and low-latency performance for handling large volumes of network traffic. 2. Enterprise Networking: It can be utilized in enterprise-grade switches and routers, enabling reliable and high-performance networking solutions for businesses. 3. Telecommunications: The chip can be employed in telecommunications equipment, such as carrier-grade switches and routers, to support high-speed and reliable network connectivity. 4. Service Provider Networks: It can be used in service provider networks to deliver high-speed internet access, video streaming, and other services to end-users. 5. Cloud Computing: The chip's high-performance capabilities make it suitable for cloud computing infrastructure, where fast and reliable networking is crucial for delivering services to users.It's important to note that the specific advantages and application scenarios may vary depending on the system design, requirements, and the capabilities of the chip. It is recommended to consult the chip's datasheet and technical documentation for detailed information and to ensure compatibility with the intended application.
MCIMX6X4AVM08AB Relevant information