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MPC755BVT300LE

MPC755BVT300LE

Manufacturer No:

MPC755BVT300LE

Manufacturer:

Freescale Semiconductor

Description:

IC MPU MPC7XX 300MHZ 360FCPBGA

Datasheet:

Datasheet

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MPC755BVT300LE Specifications

  • Type
    Parameter
  • Supplier Device Package
    360-FCPBGA (25x25)
  • Package / Case
    360-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    2.5V, 3.3V
  • USB
    -
  • SATA
    -
  • Ethernet
    -
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    -
  • Co-Processors/DSP
    -
  • Speed
    300MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    MPC7xx
The MPC755BVT300LE is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It is a PowerPC microprocessor chip designed for embedded applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The MPC755BVT300LE chip offers high processing power with a clock speed of 300 MHz, making it suitable for demanding applications that require fast and efficient processing.2. Power Efficiency: This chip is designed to be power-efficient, making it suitable for battery-powered or low-power devices. It incorporates power management features to optimize energy consumption.3. Embedded Applications: The MPC755BVT300LE chip is specifically designed for embedded systems, where it can be used in various applications such as industrial control systems, automotive electronics, networking equipment, and telecommunications devices.4. Ruggedness: This chip is built to withstand harsh environments and has a wide operating temperature range, making it suitable for applications that require reliability and durability.Application Scenarios: 1. Industrial Automation: The MPC755BVT300LE chip can be used in industrial control systems, such as programmable logic controllers (PLCs), to provide high-performance processing capabilities for real-time control and monitoring.2. Automotive Electronics: This chip can be utilized in automotive applications, such as engine control units (ECUs) or advanced driver-assistance systems (ADAS), to enable efficient and reliable processing for various automotive functions.3. Networking Equipment: The MPC755BVT300LE chip can be used in networking devices like routers, switches, or gateways, where it can handle data processing, routing, and network management tasks.4. Telecommunications: This chip can be employed in telecommunications equipment, such as base stations or network switches, to provide high-speed processing and data handling capabilities.Overall, the MPC755BVT300LE chip offers high performance, power efficiency, and ruggedness, making it suitable for a range of embedded applications that require reliable and efficient processing capabilities.
MPC755BVT300LE Relevant information