SMOMAPL138BGWTA3R

SMOMAPL138BGWTA3R

Manufacturer No:

SMOMAPL138BGWTA3R

Manufacturer:

Texas Instruments

Description:

IC MPU OMAP-L1X 375MHZ 361NFBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

SMOMAPL138BGWTA3R Specifications

  • Type
    Parameter
  • Supplier Device Package
    361-NFBGA (16x16)
  • Package / Case
    361-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Boot Security, Cryptography
  • Operating Temperature
    -40°C ~ 105°C (TJ)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • SATA
    SATA 3Gbps (1)
  • Ethernet
    10/100Mbps (1)
  • Display & Interface Controllers
    LCD
  • Graphics Acceleration
    No
  • RAM Controllers
    LPDDR, DDR2
  • Co-Processors/DSP
    Signal Processing; C674x, System Control; CP15
  • Speed
    375MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM926EJ-S
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    OMAP-L1x
The MC68MH360EM33L is a specific model of integrated circuit (IC) chip manufactured by Freescale Semiconductor (now NXP Semiconductors). It is a highly integrated microcontroller unit (MCU) designed for embedded control applications. Here are some advantages and application scenarios of the MC68MH360EM33L IC chip:Advantages: 1. High Integration: The MC68MH360EM33L integrates various components like a microprocessor, memory, peripherals, and communication interfaces into a single chip. This reduces the need for external components and simplifies the design process. 2. Powerful Processing: It features a 32-bit ColdFire V3 core, which provides high-performance processing capabilities for demanding applications. 3. On-Chip Memory: The chip includes on-chip Flash memory for program storage and on-chip RAM for data storage. This eliminates the need for external memory components and reduces the overall system cost. 4. Communication Interfaces: It supports various communication interfaces like UART, SPI, I2C, CAN, etc., enabling seamless connectivity with other devices and systems. 5. Low Power Consumption: The MC68MH360EM33L is designed to operate at low power, making it suitable for battery-powered applications or energy-efficient systems.Application Scenarios: 1. Industrial Automation: The MC68MH360EM33L can be used in industrial automation systems for controlling and monitoring processes. Its high processing power and communication interfaces make it suitable for applications like motor control, sensor interfacing, and data acquisition. 2. Internet of Things (IoT): With its integrated features and low power consumption, the chip can be used in IoT devices for collecting and processing data from sensors, communicating with other devices, and enabling remote control and monitoring. 3. Automotive Electronics: The MC68MH360EM33L can be utilized in automotive applications like engine control units (ECUs), body control modules (BCMs), and infotainment systems. Its robust processing capabilities and communication interfaces make it suitable for real-time control and communication in vehicles. 4. Consumer Electronics: The chip can be used in various consumer electronic devices like home appliances, smart devices, and multimedia systems. Its integration and processing power enable efficient control and connectivity in these applications. 5. Medical Devices: The MC68MH360EM33L can be employed in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices. Its processing capabilities and communication interfaces facilitate data processing, analysis, and communication with other medical systems.These are just a few examples of the advantages and application scenarios of the MC68MH360EM33L IC chip. The actual implementation and usage depend on the specific requirements of the application and the system design.