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MPC745BVT300LE

MPC745BVT300LE

Manufacturer No:

MPC745BVT300LE

Manufacturer:

Freescale Semiconductor

Description:

IC MPU MPC7XX 300MHZ 255FCPBGA

Datasheet:

Datasheet

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MPC745BVT300LE Specifications

  • Type
    Parameter
  • Supplier Device Package
    255-FCPBGA (21x21)
  • Package / Case
    255-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Security Features
    -
  • Operating Temperature
    0°C ~ 105°C (TA)
  • Voltage - I/O
    2.5V, 3.3V
  • USB
    -
  • SATA
    -
  • Ethernet
    -
  • Display & Interface Controllers
    -
  • Graphics Acceleration
    No
  • RAM Controllers
    -
  • Co-Processors/DSP
    -
  • Speed
    300MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    PowerPC
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    MPC7xx
The MPC745BVT300LE is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It belongs to the PowerPC family of microprocessors and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The MPC745BVT300LE chip is designed to deliver high-performance computing capabilities, making it suitable for demanding applications that require substantial processing power. 2. Power Efficiency: It is built with power-efficient architecture, allowing it to deliver performance while minimizing power consumption. This makes it suitable for applications where power efficiency is crucial. 3. Scalability: The chip offers scalability options, allowing it to be used in a wide range of applications, from embedded systems to high-performance computing environments. 4. Reliability: NXP Semiconductors is known for producing reliable and durable chips, ensuring the MPC745BVT300LE's longevity and stability in various applications. 5. Compatibility: The chip is designed to be compatible with existing PowerPC architectures, making it easier to integrate into existing systems or upgrade from previous generations.Application Scenarios: 1. Embedded Systems: The MPC745BVT300LE chip can be used in embedded systems that require high-performance computing, such as industrial automation, robotics, and automotive applications. 2. Networking and Telecommunications: It can be utilized in networking and telecommunications equipment, including routers, switches, and base stations, to handle data processing and network management tasks. 3. Aerospace and Defense: The chip's high-performance capabilities make it suitable for aerospace and defense applications, such as avionics systems, radar processing, and military-grade computing. 4. Scientific and Research Computing: The MPC745BVT300LE can be employed in scientific and research computing environments that require substantial processing power, such as simulations, data analysis, and modeling. 5. High-Performance Computing: It can be used in high-performance computing clusters or servers that require efficient processing capabilities, such as data centers, supercomputers, and cloud computing infrastructure.It's important to note that the specific application scenarios may vary depending on the requirements and system design of each project.
MPC745BVT300LE Relevant information