MPC885CVR66-FR
Manufacturer No:
MPC885CVR66-FR
Manufacturer:
Description:
IC MPU MPC8XX 66MHZ 357BGA
Datasheet:
Delivery:
Payment:
In Stock : 2861
Please send RFQ , we will respond immediately.
MPC885CVR66-FR Specifications
-
TypeParameter
-
Supplier Device Package357-PBGA (25x25)
-
Package / Case357-BBGA
-
Mounting TypeSurface Mount
-
Security FeaturesCryptography
-
Operating Temperature-40°C ~ 100°C (TA)
-
Voltage - I/O3.3V
-
USBUSB 2.0 (1)
-
SATA-
-
Ethernet10Mbps (3), 10/100Mbps (2)
-
Display & Interface Controllers-
-
Graphics AccelerationNo
-
RAM ControllersDRAM
-
Co-Processors/DSPCommunications; CPM, Security; SEC
-
Speed66MHz
-
Number of Cores/Bus Width1 Core, 32-Bit
-
Core ProcessorMPC8xx
-
PackagingBulk
-
Product StatusActive
-
SeriesMPC8xx
The MPC885CVR66-FR is a specific model of integrated circuit chip manufactured by NXP Semiconductors. It belongs to the PowerQUICC II family of microprocessors. Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The MPC885CVR66-FR chip is based on the PowerPC architecture and offers a clock speed of 66 MHz, providing high processing power for various applications. 2. Integrated Features: It integrates various peripherals and interfaces, including Ethernet, USB, UART, I2C, SPI, and more, reducing the need for additional external components. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for applications where energy consumption is a concern. 4. Industrial Temperature Range: The "FR" in the model number indicates that the chip is designed to operate in an extended temperature range, typically from -40°C to +85°C, making it suitable for industrial applications.Application Scenarios: 1. Networking Equipment: The MPC885CVR66-FR chip's Ethernet capabilities make it suitable for use in networking equipment such as routers, switches, and gateways. 2. Industrial Automation: With its industrial temperature range and integrated features, the chip can be used in various industrial automation applications, including control systems, motor drives, and industrial communication devices. 3. Embedded Systems: The high performance and low power consumption of the chip make it suitable for embedded systems, such as automotive electronics, smart appliances, and IoT devices. 4. Communication Infrastructure: The chip's integrated features, including USB and UART, make it suitable for applications in communication infrastructure, such as modems, wireless access points, and base stations.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and use cases of the target system.