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XPC860ENCZP50D3 Specifications
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TypeParameter
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Supplier Device Package357-PBGA (25x25)
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Package / Case357-BGA
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Mounting TypeSurface Mount
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Security Features-
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Operating Temperature-40°C ~ 95°C (TJ)
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Voltage - I/O-
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USB-
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SATA-
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Ethernet10Mbps (4)
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Display & Interface Controllers-
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Graphics AccelerationNo
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RAM ControllersDRAM
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Co-Processors/DSPCommunications; CPM
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Speed50MHz
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PackagingBulk
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Product StatusActive
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SeriesMPC86xx
The XPC860ENCZP50D3 is a specific model of integrated circuit (IC) chip from the XPC860 family, manufactured by NXP Semiconductors. This chip belongs to the PowerQUICC series and is designed for embedded applications. Here are some advantages and application scenarios of the XPC860ENCZP50D3:Advantages: 1. High Performance: The XPC860ENCZP50D3 chip offers a high-performance PowerPC core, capable of executing complex instructions and handling demanding tasks efficiently. 2. Integrated Peripherals: It includes various integrated peripherals like UART, Ethernet, I2C, SPI, and timers, which reduce the need for external components and simplify the overall system design. 3. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient devices. 4. Extended Temperature Range: The XPC860ENCZP50D3 chip is designed to operate reliably in extended temperature ranges, making it suitable for industrial or automotive applications.Application Scenarios: 1. Embedded Systems: The XPC860ENCZP50D3 chip is commonly used in embedded systems, such as industrial automation, robotics, and control systems, where high performance and reliability are required. 2. Networking Equipment: With integrated Ethernet support, this chip can be used in networking equipment like routers, switches, and gateways, enabling data communication and network management. 3. Automotive Electronics: The XPC860ENCZP50D3 chip's extended temperature range and robust design make it suitable for automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 4. Communication Systems: Due to its integrated peripherals and high-performance core, this chip can be used in communication systems like modems, wireless base stations, and telecommunication switches.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project.
XPC860ENCZP50D3 Relevant information
