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OMAPL138EZCED4

OMAPL138EZCED4

Manufacturer No:

OMAPL138EZCED4

Manufacturer:

Texas Instruments

Description:

IC MPU OMAP-L1X 456MHZ 361NFBGA

Datasheet:

Datasheet

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OMAPL138EZCED4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    361-NFBGA (13x13)
  • Package / Case
    361-LFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Boot Security, Cryptography
  • Operating Temperature
    -40°C ~ 90°C (TJ)
  • Voltage - I/O
    1.8V, 3.3V
  • USB
    USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • SATA
    SATA 3Gbps (1)
  • Ethernet
    10/100Mbps (1)
  • Display & Interface Controllers
    LCD
  • Graphics Acceleration
    No
  • RAM Controllers
    SDRAM
  • Co-Processors/DSP
    Signal Processing; C674x, System Control; CP15
  • Speed
    456MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM926EJ-S
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    OMAP-L1x
The TSPC603RVGH10LC integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The TSPC603RVGH10LC chips are designed for high-performance applications, offering fast processing speeds and efficient execution of complex tasks. 2. Power Efficiency: These chips are optimized for power efficiency, making them suitable for battery-powered devices or applications where power consumption is a concern. 3. Integrated Peripherals: The TSPC603RVGH10LC chips come with integrated peripherals such as timers, interrupt controllers, and communication interfaces, reducing the need for additional external components. 4. Scalability: These chips offer scalability, allowing for easy integration into various applications with different performance requirements. 5. Reliability: The TSPC603RVGH10LC chips are known for their reliability and robustness, making them suitable for critical applications that require high levels of stability and fault tolerance.Application Scenarios: 1. Embedded Systems: The TSPC603RVGH10LC chips are commonly used in embedded systems, such as industrial automation, robotics, and automotive applications, where high performance and power efficiency are crucial. 2. Communication Equipment: These chips find applications in communication equipment like routers, switches, and network appliances, where they provide fast data processing and efficient network management. 3. Medical Devices: The TSPC603RVGH10LC chips are used in medical devices like patient monitoring systems, imaging equipment, and diagnostic devices, where reliability and high-performance processing are essential. 4. Aerospace and Defense: These chips are suitable for aerospace and defense applications, including avionics systems, radar systems, and military-grade communication equipment, where reliability, performance, and power efficiency are critical. 5. Consumer Electronics: The TSPC603RVGH10LC chips can be found in consumer electronics like gaming consoles, set-top boxes, and multimedia devices, where they provide high-performance processing and power efficiency for multimedia applications.Overall, the TSPC603RVGH10LC integrated circuit chips offer high performance, power efficiency, and reliability, making them suitable for a wide range of applications in various industries.
OMAPL138EZCED4 Relevant information