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ATSAMA5D225C-D1M-CUR

ATSAMA5D225C-D1M-CUR

Manufacturer No:

ATSAMA5D225C-D1M-CUR

Manufacturer:

Microchip Technology

Description:

IC MPU SAMA5D2 500MHZ 196TFBGA

Datasheet:

Datasheet

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ATSAMA5D225C-D1M-CUR Specifications

  • Type
    Parameter
  • Supplier Device Package
    196-TFBGA (11x11)
  • Package / Case
    196-TFBGA, CSBGA
  • Mounting Type
    Surface Mount
  • Security Features
    ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - I/O
    3.3V
  • USB
    USB 2.0 + HSIC
  • SATA
    -
  • Ethernet
    10/100Mbps (1)
  • Display & Interface Controllers
    Keyboard, LCD, Touchscreen
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
  • Co-Processors/DSP
    Multimedia; NEON™ MPE
  • Speed
    500MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM® Cortex®-A5
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    SAMA5D2
The XPC850SRCVR66BU is a specific model of integrated circuit chip from the XPC850 family, designed by NXP Semiconductors. This chip is a microprocessor unit (MPU) that offers several advantages and can be used in various application scenarios. Here are some of the advantages and application scenarios of the XPC850SRCVR66BU:Advantages: 1. High Performance: The XPC850SRCVR66BU chip is based on the PowerPC architecture and operates at a clock frequency of 66 MHz, providing a high level of processing power. 2. Integrated Peripherals: This chip integrates various peripherals such as timers, interrupt controllers, UARTs, I2C, SPI, and more, reducing the need for additional external components. 3. Low Power Consumption: The XPC850SRCVR66BU is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 4. Scalability: The XPC850 family offers different models with varying clock frequencies and features, allowing for scalability based on the specific application requirements. 5. Industrial-Grade Reliability: These chips are designed to meet industrial-grade standards, ensuring reliability and robustness in harsh environments.Application Scenarios: 1. Embedded Systems: The XPC850SRCVR66BU chip is commonly used in embedded systems where a high-performance MPU is required. It can be used in applications such as industrial automation, robotics, and control systems. 2. Communication Equipment: Due to its integrated peripherals and high processing power, this chip is suitable for communication equipment like routers, switches, and network appliances. 3. Automotive Electronics: The XPC850SRCVR66BU can be used in automotive electronics applications, such as engine control units (ECUs), where real-time processing and reliability are crucial. 4. Medical Devices: The chip's low power consumption and high performance make it suitable for medical devices like patient monitoring systems, medical imaging equipment, and diagnostic devices. 5. Aerospace and Defense: The XPC850SRCVR66BU's industrial-grade reliability and performance make it suitable for aerospace and defense applications, including avionics systems, radar systems, and military-grade communication equipment.It's important to note that the specific application scenarios may vary based on the requirements and design choices of the system integrators.
ATSAMA5D225C-D1M-CUR Relevant information