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SAM9X60T-V/DWB

SAM9X60T-V/DWB

Manufacturer No:

SAM9X60T-V/DWB

Manufacturer:

Microchip Technology

Description:

IC MPU SAM9X60 600MHZ 228TFBGA

Datasheet:

Datasheet

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SAM9X60T-V/DWB Specifications

  • Type
    Parameter
  • Supplier Device Package
    228-TFBGA (11x11)
  • Package / Case
    228-TFBGA
  • Mounting Type
    Surface Mount
  • Security Features
    Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - I/O
    3.3V
  • USB
    USB 2.0 (3)
  • SATA
    -
  • Ethernet
    10/100Mbps (2)
  • Display & Interface Controllers
    Keyboard, LCD, Touchscreen
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR, LPSDR, DDR2, SDR, SRAM
  • Co-Processors/DSP
    -
  • Speed
    600MHz
  • Number of Cores/Bus Width
    1 Core, 32-Bit
  • Core Processor
    ARM926EJ-S
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    SAM9X60
The XPC823EVR66B2 is a specific integrated circuit (IC) chip manufactured by Motorola. It belongs to the PowerQUICC family of microprocessors and is designed for embedded systems and networking applications. Here are some advantages and application scenarios of the XPC823EVR66B2:Advantages: 1. High Performance: The XPC823EVR66B2 offers a clock speed of 66 MHz, providing sufficient processing power for various applications. 2. Integrated Features: It combines a PowerPC core, memory management unit, communication interfaces, and other peripherals on a single chip, reducing the need for additional components. 3. Low Power Consumption: The chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or energy-conscious applications. 4. Networking Capabilities: It includes built-in Ethernet controllers, allowing seamless integration into networking systems and facilitating data communication. 5. Scalability: The PowerQUICC family offers a range of compatible chips, allowing for easy scalability and future upgrades.Application Scenarios: 1. Embedded Systems: The XPC823EVR66B2 is commonly used in embedded systems, such as industrial automation, robotics, and control systems, where it provides the necessary processing power and connectivity options. 2. Networking Equipment: Due to its networking capabilities, the chip is suitable for various networking equipment like routers, switches, gateways, and network interface cards (NICs). 3. Communication Systems: It can be utilized in communication systems, including wireless base stations, telecommunication switches, and voice-over-IP (VoIP) devices. 4. Internet of Things (IoT): With its low power consumption and integrated features, the chip can be employed in IoT devices, enabling connectivity and processing capabilities in smart home devices, wearables, and sensor networks. 5. Automotive Electronics: The XPC823EVR66B2 can be used in automotive applications, such as engine control units (ECUs), infotainment systems, and advanced driver-assistance systems (ADAS).It's important to note that the XPC823EVR66B2 is an older chip, and there may be more advanced and suitable options available in the market today.
SAM9X60T-V/DWB Relevant information