Home / Drivers, Receivers, Transceivers / MC33662SEF/
MC33662SEF

MC33662SEF

Manufacturer No:

MC33662SEF

Manufacturer:

NXP USA Inc.

Description:

IC TRANSCEIVER HALF 1/1 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MC33662SEF Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    175 mV
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    7V ~ 18V
  • Data Rate
    20kbps
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    LINbus
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Not For New Designs
  • Series
    -
The MC33662SEF is a specific integrated circuit (IC) chip designed for automotive applications. It is a LIN (Local Interconnect Network) transceiver, which means it enables communication between various electronic control units (ECUs) in a vehicle. Here are some advantages and application scenarios of the MC33662SEF IC:Advantages: 1. Robust Communication: The MC33662SEF provides reliable and robust communication over the LIN bus, which is essential for automotive applications where data integrity is crucial. 2. Low Power Consumption: This IC chip is designed to operate with low power consumption, making it suitable for automotive systems where energy efficiency is important. 3. ESD Protection: The MC33662SEF offers built-in electrostatic discharge (ESD) protection, safeguarding the chip from potential damage due to static electricity. 4. Compact Size: The IC chip comes in a small package, allowing for space-efficient integration into automotive electronic systems.Application Scenarios: 1. Automotive Body Control Modules: The MC33662SEF can be used in body control modules to facilitate communication between various components like door locks, windows, mirrors, and lighting systems. 2. Infotainment Systems: It can be employed in infotainment systems to enable communication between the head unit, audio amplifiers, and other peripherals. 3. Climate Control Systems: The IC chip can be utilized in climate control systems to establish communication between the control panel, temperature sensors, and actuators. 4. Lighting Systems: It can be integrated into lighting systems to enable communication between the central lighting control unit and individual lights, such as headlights, taillights, and interior lights.Overall, the MC33662SEF IC chip offers reliable and efficient communication capabilities for various automotive applications, contributing to the overall functionality and performance of the vehicle's electronic systems.
MC33662SEF Relevant information