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TLIN2021DRBRQ1

TLIN2021DRBRQ1

Manufacturer No:

TLIN2021DRBRQ1

Manufacturer:

Texas Instruments

Description:

IC TRANSCEIVER FULL 1/1 8SON

Datasheet:

Datasheet

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TLIN2021DRBRQ1 Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    500 mV
  • Supplier Device Package
    8-SON (3x3)
  • Package / Case
    8-VDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    4.5V ~ 45V
  • Data Rate
    100kbps
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    LIN
  • Type
    Transceiver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
TLIN2021DRBRQ1 integrated circuit chips, manufactured by Texas Instruments, are specifically designed for automotive LIN (Local Interconnect Network) applications. Here are some advantages and application scenarios for these chips:Advantages: 1. Robust Communication: TLIN2021DRBRQ1 chips provide reliable communication over the LIN bus, ensuring robust data transmission in the automotive environment. 2. Low Power Consumption: These chips operate at low power levels, making them suitable for use in power-constrained automotive systems. 3. Small Form Factor: TLIN2021DRBRQ1 chips come in compact packages, allowing for space-efficient integration into automotive electrical systems. 4. High Integration: These chips integrate multiple functions, including LIN transceiver, voltage regulator, and wake-up capability, reducing the need for additional external components. 5. ESD Protection: The chips offer enhanced electrostatic discharge (ESD) protection, safeguarding the LIN bus communication during system operation.Application Scenarios: 1. Automotive Body Control Modules (BCMs): TLIN2021DRBRQ1 chips can be used in BCMs to control various functionalities like lighting, door locks, wipers, and mirror adjustment. 2. Power Window Control: These chips can be employed in power window control systems, enabling communication between the control unit and individual window motors. 3. HVAC Systems: TLIN2021DRBRQ1 chips can facilitate communication within heating, ventilation, and air conditioning (HVAC) systems, allowing for control of fan speed, temperature, and air distribution. 4. Seat Control Modules: These chips can be used in seat control modules to enable communication between the control unit and various seat functions like adjustment, heating, and memory settings. 5. Steering Wheel Control Systems: TLIN2021DRBRQ1 chips can be utilized in steering wheel control systems, enabling communication between the steering wheel buttons (e.g., audio controls, phone controls) and the main control unit.Overall, the TLIN2021DRBRQ1 chips offer reliable, compact, and power-efficient communication solutions for a variety of automotive applications.
TLIN2021DRBRQ1 Relevant information