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MC33662JEF

MC33662JEF

Manufacturer No:

MC33662JEF

Manufacturer:

NXP USA Inc.

Description:

IC TRANSCEIVER HALF 1/1 8SOIC

Datasheet:

Datasheet

Delivery:

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MC33662JEF Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    175 mV
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    7V ~ 18V
  • Data Rate
    10kbps
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    LINbus
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Not For New Designs
  • Series
    -
The MC33662JEF is a specific integrated circuit (IC) chip designed by NXP Semiconductors. It is primarily used for automotive applications, specifically in the area of LIN (Local Interconnect Network) communication. Here are some advantages and application scenarios of the MC33662JEF IC chip:Advantages: 1. LIN Communication: The MC33662JEF chip is specifically designed for LIN communication, which is a widely used automotive networking protocol. It enables reliable and cost-effective communication between various electronic control units (ECUs) in a vehicle.2. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for automotive applications where power efficiency is crucial.3. Robustness: The MC33662JEF chip is designed to withstand the harsh automotive environment, including temperature variations, electromagnetic interference, and voltage fluctuations. It provides robust communication even in challenging conditions.4. Integrated Features: The chip integrates various features required for LIN communication, such as LIN transceiver, voltage regulator, and wake-up functionality. This integration simplifies the design and reduces the overall system cost.Application Scenarios: 1. Automotive Body Control Modules: The MC33662JEF chip can be used in automotive body control modules, which are responsible for controlling various functions related to the vehicle's body, such as lighting, door locks, and window controls. It enables communication between different ECUs within the body control module.2. Automotive Climate Control Systems: The chip can be utilized in climate control systems, which regulate the temperature, airflow, and other parameters inside the vehicle cabin. It facilitates communication between the climate control unit and other ECUs, such as temperature sensors and fan controllers.3. Automotive Infotainment Systems: The MC33662JEF chip can be employed in infotainment systems, which provide entertainment and information services to the vehicle occupants. It enables communication between the infotainment unit and other ECUs, such as audio amplifiers, display controllers, and input devices.4. Automotive Lighting Systems: The chip can be used in automotive lighting systems, including exterior and interior lighting. It enables communication between the lighting control unit and various lighting modules, such as headlights, taillights, and interior illumination.Overall, the MC33662JEF IC chip offers advantages such as LIN communication, low power consumption, robustness, and integrated features, making it suitable for various automotive applications requiring reliable and cost-effective communication.
MC33662JEF Relevant information