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MAX230EWP+
Manufacturer No:
MAX230EWP+
Manufacturer:
Description:
IC DRIVER 5/0 20SOIC
Datasheet:
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In Stock : 0
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MAX230EWP+ Specifications
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TypeParameter
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Supplier Device Package20-SOIC
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Package / Case20-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply4.5V ~ 5.5V
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Data Rate250kbps
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Duplex-
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Number of Drivers/Receivers5/0
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ProtocolRS232
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TypeDriver
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PackagingTube
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Product StatusActive
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Series-
The TSB41BA3DPFP is a high-performance integrated circuit chip that provides several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the TSB41BA3DPFP chip are:Advantages: 1. High-speed data transfer: The TSB41BA3DPFP chip supports high-speed data transfer rates of up to 400 Mbps, making it suitable for applications that require fast and efficient data communication.2. IEEE 1394 compatibility: The chip is compliant with the IEEE 1394 standard, also known as FireWire or i.LINK, which ensures compatibility with a wide range of devices and systems that support this standard.3. Low power consumption: The TSB41BA3DPFP chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.4. Integrated PHY layer: The chip includes an integrated Physical Layer (PHY) that handles the electrical signaling and transmission of data, simplifying the design and reducing the external components required.Application Scenarios: 1. Consumer electronics: The TSB41BA3DPFP chip can be used in various consumer electronic devices such as digital cameras, camcorders, and audio/video equipment to enable high-speed data transfer and connectivity.2. Computer peripherals: It can be utilized in computer peripherals like external hard drives, scanners, and printers to provide fast and reliable data transfer between the peripheral and the computer.3. Industrial automation: The chip can be applied in industrial automation systems where high-speed data communication is required between different devices or modules, such as control systems, sensors, and actuators.4. Medical devices: Medical equipment that needs to transfer large amounts of data, such as medical imaging devices or patient monitoring systems, can benefit from the high-speed data transfer capabilities of the TSB41BA3DPFP chip.5. Automotive applications: The chip can be used in automotive systems for data communication between various components, such as infotainment systems, diagnostic tools, or in-vehicle networking.Overall, the TSB41BA3DPFP integrated circuit chip offers advantages like high-speed data transfer, compatibility with IEEE 1394 standard, low power consumption, and integrated PHY layer, making it suitable for a wide range of applications in consumer electronics, computer peripherals, industrial automation, medical devices, and automotive systems.
MAX230EWP+ Relevant information
