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MAX3075EASA+T

MAX3075EASA+T

Manufacturer No:

MAX3075EASA+T

Description:

IC TRANSCEIVER HALF 1/1 8SOIC

Datasheet:

Datasheet

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MAX3075EASA+T Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    100 mV
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    3V ~ 3.6V
  • Data Rate
    500kbps
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MAX3075EASA+T is an integrated circuit chip designed for use in industrial applications. It is a robust, high-speed, low-power transceiver chip that offers several advantages and can be used in various scenarios. Some of the advantages and application scenarios of the MAX3075EASA+T are:Advantages: 1. Robustness: The chip is designed to withstand harsh industrial environments, making it suitable for applications that require high reliability and durability. 2. High-speed communication: The MAX3075EASA+T supports high-speed data transmission up to 25Mbps, making it ideal for applications that require fast and efficient communication. 3. Low-power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 4. ESD protection: The MAX3075EASA+T provides built-in electrostatic discharge (ESD) protection, ensuring the chip's reliability and preventing damage from static electricity.Application scenarios: 1. Industrial automation: The MAX3075EASA+T can be used in industrial automation systems for communication between various devices, such as sensors, actuators, and controllers. Its robustness and high-speed communication capabilities make it suitable for this application. 2. Building automation: The chip can be used in building automation systems for communication between different components, such as lighting control systems, HVAC systems, and security systems. Its low-power consumption and ESD protection make it suitable for this application. 3. Process control: The MAX3075EASA+T can be used in process control systems for communication between different sensors, actuators, and control units. Its robustness and high-speed communication capabilities make it suitable for this application. 4. Energy management: The chip can be used in energy management systems for communication between smart meters, energy monitoring devices, and control units. Its low-power consumption and high-speed communication capabilities make it suitable for this application.Overall, the MAX3075EASA+T integrated circuit chip offers advantages such as robustness, high-speed communication, low-power consumption, and ESD protection, making it suitable for various industrial applications that require reliable and efficient communication.
MAX3075EASA+T Relevant information