LTC2857HDD-2#TRPBF

LTC2857HDD-2#TRPBF

Manufacturer No:

LTC2857HDD-2#TRPBF

Manufacturer:

Analog Devices Inc.

Description:

IC TRANSCEIVER FULL 1/1 8DFN

Datasheet:

Datasheet

Delivery:

Payment:

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LTC2857HDD-2#TRPBF Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-DFN (3x3)
  • Package / Case
    8-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Data Rate
    250kbps
  • Receiver Hysteresis
    25 mV
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The LTC2857HDD-2#TRPBF is a specific integrated circuit (IC) chip manufactured by Linear Technology (now part of Analog Devices). While I don't have access to the specific datasheet for this chip, I can provide you with some general information about IC chips and their advantages and application scenarios.Advantages of IC chips in general include:1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, reducing the size and complexity of electronic systems.2. Power efficiency: IC chips are designed to be power-efficient, which is crucial for portable devices and energy-conscious applications.3. Reliability: IC chips are manufactured using advanced processes, resulting in improved reliability and performance compared to discrete components.4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable compared to individual discrete components.As for the application scenarios of the LTC2857HDD-2#TRPBF chip, it would be best to refer to the datasheet or application notes provided by Linear Technology or Analog Devices. These documents typically outline the specific features, recommended usage, and target applications for the chip. The LTC2857HDD-2#TRPBF chip may have been designed for a particular purpose, such as communication interfaces, power management, or signal conditioning.