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XR33053IDTR-F

XR33053IDTR-F

Manufacturer No:

XR33053IDTR-F

Manufacturer:

MaxLinear, Inc.

Description:

IC TRANSCEIVER FULL 1/1 14SOIC

Datasheet:

Datasheet

Delivery:

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XR33053IDTR-F Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 5.5V
  • Data Rate
    1Mbps
  • Receiver Hysteresis
    170 mV
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XR33053IDTR-F integrated circuit chips, manufactured by Exar Corporation, are high-speed, low-power RS-485 transceivers. Here are some of their advantages and application scenarios:Advantages: 1. High-Speed Communication: The XR33053IDTR-F supports data rates up to 20 Mbps, enabling fast and efficient data transmission. 2. Low-Power Operation: These chips have low quiescent current consumption, making them suitable for power-sensitive applications. 3. Short-Circuit Protection: They offer built-in short-circuit and thermal shutdown protection, enhancing the overall reliability and safety of the system. 4. Robust Communication: The RS-485 protocol used by these chips provides robust data transfer over long distances and in harsh environments. 5. Wide Supply Voltage Range: The XR33053IDTR-F supports a wide operating voltage range, providing flexibility in various system designs.Application Scenarios: 1. Industrial Automation: The XR33053IDTR-F is commonly used in industrial automation systems that require long-distance communication between various devices. It ensures reliable data transmission even in electrically noisy environments. 2. Building Automation: The chips find applications in building automation systems, such as HVAC (heating, ventilation, and air conditioning) control, lighting control, and security systems. They enable communication between different building automation devices over long distances. 3. Smart Grids: In smart grid applications, the XR33053IDTR-F facilitates communication between different nodes, such as energy meters, distribution automation devices, and renewable energy sources. It ensures efficient data transfer and monitoring throughout the grid. 4. Automotive Systems: These chips are suitable for automotive applications that require reliable communication between different electronic control units (ECUs), sensors, and actuators. They can operate in the automotive temperature range and withstand harsh automotive conditions. 5. Communication Networks: The XR33053IDTR-F is used in communication networks where RS-485 is employed, such as data acquisition systems, point-of-sale terminals, and multi-drop data transmission applications.Overall, the XR33053IDTR-F integrated circuit chips offer high-speed, low-power, and reliable communication in various industrial, building automation, automotive, and networking applications.
XR33053IDTR-F Relevant information