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MCP2003T-E/MD

MCP2003T-E/MD

Manufacturer No:

MCP2003T-E/MD

Manufacturer:

Microchip Technology

Description:

IC TRANSCEIVER HALF 1/1 8DFN

Datasheet:

Datasheet

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MCP2003T-E/MD Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-DFN (4x4)
  • Package / Case
    8-VDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    6V ~ 27V
  • Data Rate
    -
  • Receiver Hysteresis
    175 mV
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    LINbus
  • Type
    Transceiver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The MCP2003T-E/MD is an integrated circuit chip that is specifically designed for automotive applications. It is a LIN (Local Interconnect Network) transceiver, which means it enables communication between various electronic control units (ECUs) in a vehicle.Advantages of MCP2003T-E/MD:1. LIN Communication: The chip supports LIN bus communication, which is widely used in automotive applications for low-speed data communication between different ECUs. It allows for reliable and cost-effective communication in automotive networks.2. High-Speed Data Transfer: The MCP2003T-E/MD supports data transfer rates up to 20 kbps, which is sufficient for most automotive applications. It ensures efficient and timely communication between ECUs.3. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for automotive applications where power efficiency is crucial. It helps in reducing overall power consumption in the vehicle.4. Robustness and Reliability: The MCP2003T-E/MD is designed to withstand the harsh automotive environment, including temperature variations, electromagnetic interference, and voltage fluctuations. It ensures reliable operation even in challenging conditions.Application Scenarios:1. Automotive Body Control Modules: The chip can be used in body control modules to enable communication between various components like door locks, window controls, lighting systems, and other body-related functions.2. Infotainment Systems: It can be utilized in infotainment systems to facilitate communication between different modules like audio systems, displays, and control units. This allows for seamless integration and control of various infotainment features.3. Climate Control Systems: The MCP2003T-E/MD can be employed in climate control systems to enable communication between temperature sensors, HVAC (Heating, Ventilation, and Air Conditioning) controls, and other related components. It helps in maintaining optimal climate control within the vehicle.4. Powertrain Control Modules: It can be used in powertrain control modules to facilitate communication between engine control units, transmission control units, and other powertrain-related components. This enables efficient control and coordination of the powertrain system.Overall, the MCP2003T-E/MD integrated circuit chip offers advantages like LIN communication support, high-speed data transfer, low power consumption, and robustness, making it suitable for various automotive applications requiring reliable and efficient communication between ECUs.
MCP2003T-E/MD Relevant information