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BDGLA16P

BDGLA16P

Manufacturer No:

BDGLA16P

Manufacturer:

Agere Systems

Description:

IC LINE DRVR 4/0 16DIP

Datasheet:

Datasheet

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BDGLA16P Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    -
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Data Rate
    400Mbps
  • Duplex
    -
  • Number of Drivers/Receivers
    4/0
  • Protocol
    -
  • Type
    Line Driver
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The BDGLA16P integrated circuit chips have several advantages and application scenarios:1. High Performance: The BDGLA16P chips are designed to deliver high performance with low power consumption. They offer fast processing speeds and efficient data handling capabilities.2. Memory Capacity: These chips have a large memory capacity, allowing them to store and process a significant amount of data. This makes them suitable for applications that require extensive data storage and retrieval.3. Versatility: The BDGLA16P chips are versatile and can be used in various applications. They can be integrated into different electronic devices and systems, including computers, smartphones, and IoT devices.4. Communication Capabilities: These chips have built-in communication capabilities, enabling them to connect and interact with other devices and systems. This makes them suitable for applications that require data exchange and communication between multiple devices.5. Security Features: The BDGLA16P chips come with advanced security features, such as encryption and authentication mechanisms. This makes them suitable for applications that require secure data storage and transmission, such as financial transactions and sensitive data handling.Application Scenarios:1. Consumer Electronics: The BDGLA16P chips can be used in consumer electronics, such as smartphones, tablets, and smart TVs. They can enhance the performance and memory capacity of these devices, enabling faster processing and efficient data storage.2. Internet of Things (IoT): These chips can be integrated into IoT devices, such as smart home appliances, wearables, and industrial sensors. They can handle the data processing and communication requirements of these devices, enabling seamless connectivity and efficient data management.3. Data Centers: The BDGLA16P chips can be used in data centers to enhance the processing and storage capabilities. They can handle large volumes of data and enable efficient data management in cloud computing environments.4. Automotive Systems: These chips can be used in automotive systems, such as advanced driver-assistance systems (ADAS) and infotainment systems. They can handle the processing requirements of these systems, enabling real-time data analysis and communication.5. Financial Services: The BDGLA16P chips can be used in financial services, such as banking and payment systems. They can handle secure data storage and transmission, ensuring the confidentiality and integrity of financial transactions.Overall, the BDGLA16P integrated circuit chips offer high performance, large memory capacity, versatility, and security features, making them suitable for a wide range of applications in various industries.
BDGLA16P Relevant information