MAX3074EESA

MAX3074EESA

Manufacturer No:

MAX3074EESA

Description:

IC TRANSCEIVER FULL 1/1 8SOIC

Datasheet:

Datasheet

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MAX3074EESA Specifications

  • Type
    Parameter
  • Receiver Hysteresis
    15 mV
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.97V ~ 3.63V
  • Data Rate
    500kbps
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MAX3074EESA is a high-speed, ±80V fault-protected CAN transceiver chip, which is specifically designed for industrial applications. Some of the advantages and application scenarios of the MAX3074EESA integrated circuit chips are:1. High-Speed Data Transfer: The MAX3074EESA supports high-speed data rates up to 5Mbps, making it suitable for applications that require fast and reliable communication.2. Fault Protection: It provides ±80V bus fault protection, which helps safeguard the transceiver from electrical transients and voltage spikes that can occur in harsh industrial environments.3. Robust Operation: The chip offers excellent electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection, ensuring reliable operation even in challenging conditions.4. Wide Operating Voltage Range: It operates over a wide range of supply voltages, typically from 4.75V to 5.25V, making it versatile and compatible with various power sources.5. Industrial Applications: The MAX3074EESA is primarily used in industrial automation, process control systems, automotive applications, sensor networks, and other industrial settings where reliable and high-speed communication is crucial.6. Compliance with Standards: The chip is compliant with the CAN 2.0B and ISO 11898-2 standards, making it compatible with a wide range of CAN bus systems.7. Small Form Factor: The integrated circuit comes in a small package (SSOP), which enables space-efficient designs, especially in applications with size constraints.Overall, the MAX3074EESA integrated circuit chips offer robust fault protection, high-speed data transfer, and wide compatibility, making them ideal for industrial applications that require reliable communication in harsh environments.