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DS229EN+

DS229EN+

Manufacturer No:

DS229EN+

Description:

IC TRANSCEIVER FULL 3/5 20TSSOP

Datasheet:

Datasheet

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DS229EN+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Data Rate
    200kbps
  • Receiver Hysteresis
    500 mV
  • Duplex
    Full
  • Number of Drivers/Receivers
    3/3
  • Protocol
    RS232
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS229EN+ integrated circuit chips, also known as 2.5G/10G/40G/100GbE PHY chips, have several advantages and application scenarios:Advantages: 1. Flexibility: The DS229EN+ chips support multiple data rates, including 2.5Gbps, 10Gbps, 40Gbps, and 100Gbps, making them highly flexible for various networking applications. 2. Low power consumption: These chips are designed to consume low power, making them ideal for energy-efficient environments and reducing the overall power footprint. 3. High performance: The DS229EN+ chips offer high-performance levels with low latency and high-speed data transmission, ensuring excellent network connectivity. 4. Advanced features: The chips provide advanced features like forward error correction (FEC), electronic dispersion compensation (EDC), and laser load-sharing, maximizing the reliability and quality of the network transmission.Application scenarios: 1. Data center networking: The DS229EN+ chips find extensive use in data centers for high-speed network connectivity between servers, switches, and storage devices. They enable rapid data transfer, reducing latency, and improving overall performance. 2. Telecommunications: With support for multiple data rates, these chips are suitable for telecommunications equipment like routers, gateways, and switches, enabling seamless and reliable communications at various speeds. 3. High-performance computing: The DS229EN+ chips can be used in high-performance computing systems where fast interconnection between computing nodes is essential. They ensure efficient data transmission, allowing for faster processing and analysis. 4. Network infrastructure: These chips are deployed in network infrastructure equipment such as routers, switches, and optical transport systems, enabling high-speed data transmission while maintaining low power consumption.In summary, the DS229EN+ integrated circuit chips offer flexibility, low power consumption, high performance, and advanced features, making them well-suited for applications in data centers, telecommunications, high-performance computing, and network infrastructure equipment.
DS229EN+ Relevant information