MAX3089ECSD+

MAX3089ECSD+

Manufacturer No:

MAX3089ECSD+

Description:

IC TRANSCEIVER FULL 1/1 14SOIC

Datasheet:

Datasheet

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MAX3089ECSD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    4.75V ~ 5.25V
  • Data Rate
    10Mbps
  • Receiver Hysteresis
    100 mV
  • Duplex
    Full
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS422, RS485
  • Type
    Transceiver
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The MAX3089ECSD+ is a high-speed, low-power, and low-voltage RS-485/RS-422 transceiver integrated circuit chip. It offers several advantages and can be applied in various scenarios:Advantages: 1. High-Speed Communication: The MAX3089ECSD+ supports data rates up to 20Mbps, making it suitable for applications requiring fast and reliable communication.2. Low Power Consumption: This chip operates at low power, making it ideal for battery-powered devices or applications where power efficiency is crucial.3. Low-Voltage Operation: The MAX3089ECSD+ can operate at a supply voltage as low as 3.0V, enabling its use in low-power and low-voltage systems.4. Robust Communication: It features ±15kV ESD protection on the RS-485/RS-422 bus pins, ensuring reliable communication in harsh industrial environments.5. Wide Temperature Range: The chip can operate in a wide temperature range (-40°C to +85°C), making it suitable for industrial applications that require operation in extreme temperatures.Application Scenarios: 1. Industrial Automation: The MAX3089ECSD+ is commonly used in industrial automation systems for communication between various devices, such as sensors, actuators, and controllers. Its high-speed and robust communication capabilities make it suitable for real-time control and monitoring applications.2. Building Automation: In building automation systems, the chip can be used for communication between different subsystems, such as HVAC (Heating, Ventilation, and Air Conditioning), lighting control, and security systems. Its low-power operation and wide temperature range make it suitable for long-term and reliable operation.3. Automotive Electronics: The MAX3089ECSD+ can be utilized in automotive applications, such as in-vehicle networks, infotainment systems, and automotive control modules. Its robust communication and ESD protection ensure reliable data transmission in the presence of electrical noise and harsh automotive environments.4. Renewable Energy Systems: The chip can be employed in renewable energy systems, such as solar power plants or wind farms, for communication between various components, including inverters, monitoring systems, and energy storage devices. Its low-power operation is beneficial for energy-efficient systems.5. Medical Devices: The MAX3089ECSD+ can be used in medical devices that require reliable and high-speed communication, such as patient monitoring systems, medical imaging equipment, and laboratory instruments. Its low-power operation is advantageous for battery-powered portable devices.Overall, the MAX3089ECSD+ integrated circuit chip offers high-speed, low-power, and robust communication capabilities, making it suitable for a wide range of applications in industrial, automotive, building automation, renewable energy, and medical sectors.