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ADM3066EACPZ

ADM3066EACPZ

Manufacturer No:

ADM3066EACPZ

Manufacturer:

Analog Devices Inc.

Description:

IC TRANSCEIVER HALF 1/1 10LFCSP

Datasheet:

Datasheet

Delivery:

Payment:

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ADM3066EACPZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-LFCSP-WD (3x3)
  • Package / Case
    10-VFDFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 5.5V
  • Data Rate
    50Mbps
  • Receiver Hysteresis
    30 mV
  • Duplex
    Half
  • Number of Drivers/Receivers
    1/1
  • Protocol
    RS485
  • Type
    Transceiver
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The ADM3066EACPZ is an integrated circuit chip designed by Analog Devices Inc. It is specifically used for industrial applications that require robust and reliable communication interfaces. Here are some advantages and application scenarios of the ADM3066EACPZ:Advantages: 1. Robustness: The ADM3066EACPZ is built to withstand harsh industrial environments, making it suitable for applications that require high levels of reliability and durability. 2. High-speed communication: It supports data rates up to 50 Mbps, enabling fast and efficient communication between devices. 3. ESD Protection: The chip provides enhanced electrostatic discharge (ESD) protection, safeguarding the connected devices from potential damage caused by static electricity. 4. Low power consumption: The ADM3066EACPZ is designed to operate with low power consumption, making it suitable for battery-powered applications or energy-efficient systems. 5. Wide temperature range: It can operate reliably across a wide temperature range, typically from -40°C to +125°C, making it suitable for industrial environments with extreme temperature conditions.Application scenarios: 1. Industrial automation: The ADM3066EACPZ can be used in various industrial automation systems, such as programmable logic controllers (PLCs), motor control systems, and industrial sensors, to enable reliable communication between different components. 2. Process control systems: It can be employed in process control systems, such as distributed control systems (DCS), to facilitate communication between different modules and ensure accurate data exchange. 3. Building automation: The chip can be utilized in building automation systems, including HVAC (heating, ventilation, and air conditioning) systems, lighting control systems, and security systems, to enable efficient communication and control between different building components. 4. Energy management systems: It can be integrated into energy management systems, such as smart grid infrastructure, to enable reliable communication between energy meters, sensors, and control devices. 5. Automotive applications: The ADM3066EACPZ can be used in automotive systems, such as in-vehicle networks, to facilitate communication between various electronic control units (ECUs) and ensure reliable data transmission.These are just a few examples of the advantages and application scenarios of the ADM3066EACPZ integrated circuit chip. Its robustness, high-speed communication capabilities, ESD protection, low power consumption, and wide temperature range make it suitable for a range of industrial applications requiring reliable and efficient communication interfaces.
ADM3066EACPZ Relevant information